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NLX2G16CMUTCG

Onsemi

NLX2G16CMUTCG by Onsemi

NLX2G16CMUTCG by Onsemi is a CMOS Logic Gate with 10.2ns Propagation Delay, suitable for military applications. It operates at a voltage range of 1.65V to 5.5V and has a load capacitance of 15pF, making it ideal for high-speed signal processing in harsh environments. The package style is small outline with very thin profile, featuring dual terminal position and nickel gold palladium finish for robust performance.

Median Price

$0.053

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 32,000 parts In-Stock

1+ parts

-

100+ parts

$0.053

1k+ parts

$0.044

10k+ parts

$0.039

32,000

-

$0.053

$0.044

$0.039

DigiKey

USA . 32,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.070

32,000

-

-

-

$0.070

Verical

USA . 32,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.049

32,000

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-

-

$0.049

Distributors (In-Stock)

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Digiode

USA . 1,343 parts In-Stock

1+ parts

$0.041

100+ parts

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1,343

$0.041

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Vyrian

USA . 4,607 parts In-Stock

1+ parts

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4,607

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Distributors (Availability)

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Corphita

USA . 2,150 parts In-Stock

1+ parts

$0.039

100+ parts

-

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2,150

$0.039

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Vigor

Singapore . 398 parts In-Stock

1+ parts

$0.040

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398

$0.040

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-

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Corohmni

South Africa . 129 parts In-Stock

1+ parts

$0.043

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129

$0.043

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AZTECH Wire

Italy . 39 parts In-Stock

1+ parts

$17.420

100+ parts

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39

$17.420

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Continental Prestige Electronics

USA . 45,000 parts In-Stock

1+ parts

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100+ parts

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$0.038

10k+ parts

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45,000

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$0.038

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SupplyDigital Components

Austria . 6,063 parts In-Stock

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6,063

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QUARKTWIN TECHNOLOGY LTD

USA . 4,808 parts In-Stock

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Microchip USA

USA . 3,473 parts In-Stock

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Kulean Microsystems

USA . 2,603 parts In-Stock

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2,603

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Problanco Electronics

Mexico . 2,597 parts In-Stock

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2,597

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TANS Electronics

Latvia . 2,422 parts In-Stock

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UHIMA Technologies

Türkiye . 351 parts In-Stock

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Overview

Enhance your electronic projects with the NLX2G16CMUTCG logic gates from Onsemi. Known for their high-quality products, Onsemi delivers reliable components that meet industry standards. The NLX2G16CMUTCG is perfect for a wide range of applications, offering fast propagation delays and low power consumption. With its compact size and easy surface mount installation, this logic gate provides value and efficiency to your designs. Upgrade your circuits with Onsemi's NLX2G16CMUTCG for superior performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and transport.

Propagation Delay At Nominal Supply: 10.2 ns

The fast propagation delay ensures quick response times and efficient operation.

Surface Mount: YES

The ability to surface mount the product makes installation and integration simple and space-saving.

Nominal Supply Voltage / Vsup (V): 2.3

The nominal supply voltage of 2.3V makes this product energy efficient and suitable for low voltage applications.

Load Capacitance (CL): 15 pF

The low load capacitance helps in maintaining signal integrity and reducing interference.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and extended use.

Minimum Operating Temperature: -55 °C

The wide operating temperature range allows this product to be used in diverse climates and environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it a reliable choice for various applications.

Technical Specifications

Logic Gates NLX2G16CMUTCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

2G

JESD-30 Code:

S-PDSO-N6

Length:

1 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

10.2 ns

Propagation Delay (tpd):

10.2 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX2G16CMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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