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NLV74LCX573DTR2G

Onsemi

NLV74LCX573DTR2G by Onsemi

NLV74LCX573DTR2G by Onsemi is an 8-bit bus driver with 10.5ns propagation delay and 24A max I (ol). It operates at a supply voltage of 2-3.6V, suitable for military-grade applications requiring fast signal transmission in compact spaces.

Median Price

$0.398

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,345 parts In-Stock

1+ parts

-

100+ parts

$0.391

1k+ parts

$0.325

10k+ parts

$0.290

7,345

-

$0.391

$0.325

$0.290

Verical

USA . 6,835 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.406

10k+ parts

$0.362

6,835

-

-

$0.406

$0.362

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,847 parts In-Stock

1+ parts

$0.305

100+ parts

-

1k+ parts

-

10k+ parts

-

1,847

$0.305

-

-

-

Vyrian

USA . 3,324 parts In-Stock

1+ parts

-

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-

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3,324

-

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,205 parts In-Stock

1+ parts

$0.289

100+ parts

-

1k+ parts

-

10k+ parts

-

1,205

$0.289

-

-

-

Corohmni

South Africa . 222 parts In-Stock

1+ parts

$0.321

100+ parts

-

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10k+ parts

-

222

$0.321

-

-

-

Vigor

Singapore . 228 parts In-Stock

1+ parts

$0.330

100+ parts

-

1k+ parts

-

10k+ parts

-

228

$0.330

-

-

-

AZTECH Wire

Italy . 1,185 parts In-Stock

1+ parts

$8.530

100+ parts

-

1k+ parts

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10k+ parts

-

1,185

$8.530

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 8,397 parts In-Stock

1+ parts

-

100+ parts

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8,397

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SupplyDigital Components

Austria . 5,414 parts In-Stock

1+ parts

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5,414

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Microchip USA

USA . 3,451 parts In-Stock

1+ parts

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100+ parts

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3,451

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TANS Electronics

Latvia . 2,634 parts In-Stock

1+ parts

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2,634

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Problanco Electronics

Mexico . 1,971 parts In-Stock

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1,971

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Kulean Microsystems

USA . 1,509 parts In-Stock

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1,509

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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500

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UHIMA Technologies

Türkiye . 149 parts In-Stock

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149

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Overview

Enhance your electronic designs with the NLV74LCX573DTR2G by Onsemi! Crafted with precision and quality, this bus driver & transceiver is a game-changer in the industry. With a wide range of applications, this product offers unmatched value to customers looking for reliability and efficiency. Experience the benefits of fast propagation delay, low power consumption, and high output characteristics. Trust Onsemi to deliver cutting-edge technology that meets your needs. Elevate your projects with the NLV74LCX573DTR2G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in a variety of applications.

Propagation Delay At Nominal Supply: 8 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed data communication.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the product meets automotive quality standards, making it reliable for use in automotive applications.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V is commonly used in many electronic systems, making this product compatible with a wide range of applications.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF reduces signal distortion and improves signal integrity, making this product suitable for high-frequency applications.

Power Supplies (V): 3.3

The power supply voltage of 3.3V is a standard voltage level in many electronic devices, ensuring compatibility with various systems.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit board layout and connection, making it easier to integrate this product into different designs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers NLV74LCX573DTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLV74LCX573DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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