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NLV74HC125ADTG

Onsemi

NLV74HC125ADTG by Onsemi

NLV74HC125ADTG by Onsemi is a 4-function bus driver with 27ns propagation delay, suitable for military applications. It operates at supply voltages of 2-6V, has a load capacitance of 50pF, and features a max operating temperature of 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,683 parts In-Stock

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Digiode

USA . 316 parts In-Stock

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Vigor

Singapore . 388 parts In-Stock

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$0.490

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388

$0.490

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AZTECH Wire

Italy . 550 parts In-Stock

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$10.930

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550

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Component Stockers USA

USA . 313 parts In-Stock

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$99.990

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Problanco Electronics

Mexico . 6,901 parts In-Stock

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Kulean Microsystems

USA . 5,038 parts In-Stock

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SupplyDigital Components

Austria . 2,456 parts In-Stock

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Corphita

USA . 2,095 parts In-Stock

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TANS Electronics

Latvia . 621 parts In-Stock

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UHIMA Technologies

Türkiye . 559 parts In-Stock

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Microchip USA

USA . 499 parts In-Stock

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Corohmni

South Africa . 263 parts In-Stock

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Overview

Unlock the power of reliable data transmission with the NLV74HC125ADTG by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and performance. Ideal for bus driver and transceiver applications, this product offers fast propagation delay, low power consumption, and wide temperature range. With a compact design and high durability, customers can trust in the value and benefits that this product brings to their projects. Stay ahead of the competition with the NLV74HC125ADTG from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package of this product durable and lightweight, ensuring a long lifespan and easy handling.

Propagation Delay At Nominal Supply: 27 ns

The low propagation delay at nominal supply voltage ensures fast and efficient signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design, making this product convenient for compact electronic systems.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is commonly used in many electronic systems, ensuring compatibility and easy integration with existing setups.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this product can withstand tough environmental conditions, making it suitable for industrial and automotive applications.

Technical Specifications

Bus Driver & Transceivers NLV74HC125ADTG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLV74HC125ADTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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