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NLV74HC245ADTR2G

Onsemi

NLV74HC245ADTR2G by Onsemi

NLV74HC245ADTR2G by Onsemi is an 8-bit bus driver with a propagation delay of 22ns at 5V. It features a small outline package, operates b/w -55 to 125 °C, and has dual terminal positions. Ideal for bidirectional control applications in military-grade environments.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Flip Electronics

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Vigor

Singapore . 127 parts In-Stock

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$0.330

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Microchip USA

USA . 4,255 parts In-Stock

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AZTECH Wire

Italy . 884 parts In-Stock

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TANS Electronics

Latvia . 4,839 parts In-Stock

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Problanco Electronics

Mexico . 4,407 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

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Corphita

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Corohmni

South Africa . 462 parts In-Stock

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UHIMA Technologies

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Overview

Enhance your electronic designs with the NLV74HC245ADTR2G by Onsemi, a top-quality bus driver and transceiver offering exceptional performance and reliability. Manufactured by Onsemi, a trusted industry leader, this versatile component is perfect for a wide range of applications. With its 3-STATE output characteristics and low propagation delay, this product ensures seamless data transmission while maximizing efficiency. Say goodbye to compatibility issues and welcome seamless integration with this innovative solution. Trust Onsemi for cutting-edge technology that delivers value and surpasses expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to external elements, making the product suitable for various environments and applications.

Propagation Delay At Nominal Supply: 22 ns

Ensures fast data transmission and response times, enhancing the efficiency of the bus driver and transceivers.

Surface Mount: YES

Facilitates easy and convenient installation on circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and quality, making it suitable for automotive applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, ensuring compatibility with other components and systems.

Power Supplies (V): 2/6

Supports a range of power supply voltages, offering flexibility in different operating conditions.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures without compromising performance, ideal for demanding industrial environments.

Temperature Grade: MILITARY

Meets stringent military standards for reliability and performance, suitable for military and aerospace applications.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and high-speed operation, ideal for energy-efficient devices.

Technical Specifications

Bus Driver & Transceivers NLV74HC245ADTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLV74HC245ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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