Loading...

NLV74HC125ADG

Onsemi

NLV74HC125ADG by Onsemi

NLV74HC125ADG by Onsemi is a 4-function bus driver with 27ns propagation delay at 5V. It has a small outline package, operates b/w -55 to 125 °C, and is AEC-Q100 screened for automotive applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,089 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,089

-

-

-

-

Digiode

USA . 2,187 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,187

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 754 parts In-Stock

1+ parts

$0.450

100+ parts

-

1k+ parts

-

10k+ parts

-

754

$0.450

-

-

-

AZTECH Wire

Italy . 1,162 parts In-Stock

1+ parts

$9.240

100+ parts

-

1k+ parts

-

10k+ parts

-

1,162

$9.240

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$15.412

100+ parts

$14.025

1k+ parts

$12.638

10k+ parts

-

1,000

$15.412

$14.025

$12.638

-

QUARKTWIN TECHNOLOGY LTD

USA . 5,599 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,599

-

-

-

-

Kulean Microsystems

USA . 4,349 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,349

-

-

-

-

TANS Electronics

Latvia . 3,487 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,487

-

-

-

-

Problanco Electronics

Mexico . 3,449 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,449

-

-

-

-

Corphita

USA . 1,205 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,205

-

-

-

-

UHIMA Technologies

Türkiye . 583 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

583

-

-

-

-

Microchip USA

USA . 499 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

499

-

-

-

-

SupplyDigital Components

Austria . 487 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

487

-

-

-

-

Corohmni

South Africa . 63 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

63

-

-

-

-

Overview

Enhance your electronics projects with the NLV74HC125ADG by Onsemi, a high-quality bus driver and transceiver that offers unparalleled performance and reliability. Manufactured by Onsemi, a leader in semiconductor solutions, this versatile component is perfect for a wide range of applications. With its advanced features and cutting-edge technology, the NLV74HC125ADG provides exceptional value, benefits, and advantages to customers looking for superior quality and functionality in their designs. Experience the difference with Onsemi's NLV74HC125ADG - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various environments.

Propagation Delay At Nominal Supply: 27 ns

The low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes the product easy to install and saves space on the PCB, making it a convenient choice for compact designs.

No. of Functions: 4

With multiple functions in a single component, this product offers cost and space savings while providing versatile functionality.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures the product's reliability and suitability for automotive applications where quality and durability are essential.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is a common standard in many applications, ensuring compatibility with a wide range of systems.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing power consumption and improving signal integrity, making this product energy-efficient.

Power Supplies (V): 2/6

The dual power supply support allows for flexibility in voltage input, accommodating different system requirements with ease.

No. of Terminals: 14

With a higher number of terminals, this product offers better connectivity options and functionality for complex circuit designs.

Maximum I (ol): 6 Amp

The high maximum output current capability of 6A ensures reliable performance even under heavy loads, making it suitable for demanding applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the product to withstand harsh environmental conditions and ensures long-term reliability.

Output Characteristics: 3-STATE

The 3-state output allows for more flexible control of signals, making this product versatile and suitable for a variety of applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the product can function in extreme cold conditions, adding to its reliability and durability.

Terminal Finish: MATTE TIN

The matte tin finish offers good solderability and corrosion resistance, enhancing the product's longevity and performance.

Terminal Position: DUAL

The dual terminal position provides flexibility in installation and PCB layout, making it easier to integrate the product into different designs.

No. of Ports: 2

Having two ports allows for more connections and data transfer options, increasing the product's versatility and usability in diverse systems.

Maximum Seated Height: 1.75 mm

The low maximum seated height helps in saving space on the PCB and enables compact and slim device designs.

Width: 3.9 mm

The narrow width of 3.9mm makes the product suitable for applications with space constraints and allows for efficient use of PCB space.

Output Polarity: TRUE

Having true output polarity ensures proper signal transmission and compatibility with other components, contributing to reliable system operation.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage requirement of 2V enables the product to operate in low-power conditions, making it energy-efficient.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability of 260 °C allows for lead-free soldering and ensures the product's compatibility with RoHS standards.

Length: 8.65 mm

The compact length of 8.65mm helps in space-saving on the PCB and enables the product to be used in small form factor devices.

Temperature Grade: MILITARY

The military-grade temperature rating ensures the product's reliability and performance in extreme temperature conditions, making it suitable for rugged applications.

Technology: CMOS

The CMOS technology used in the product offers low power consumption, high noise immunity, and fast switching speeds, making it an efficient choice for various applications.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and ease of soldering, ensuring reliable connections and long-term performance.

Packing Method: RAIL

The rail packing method facilitates easy handling, storage, and assembly of the product, making it convenient for manufacturing processes.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27mm allows for easy integration into standard PCB designs and promotes efficient signal routing.

Control Type: ENABLE LOW

The enable low control type offers flexibility in managing the device's operation and power consumption, making it suitable for various system requirements.

Maximum Supply Voltage (Vsup): 6 V

The high maximum supply voltage of 6V allows for compatibility with a wide range of power sources and ensures reliable operation in different voltage environments.

Technical Specifications

Bus Driver & Transceivers NLV74HC125ADG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV74HC125ADG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19