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NLV74HC125ADTR2G

Onsemi

NLV74HC125ADTR2G by Onsemi

NLV74HC125ADTR2G by Onsemi is a 4-function bus driver with 27ns propagation delay, suitable for military applications. It operates at a nominal voltage of 5V and has a load capacitance of 50pF. With a small outline package style, it features true output polarity and dual terminal position.

Median Price

$0.435

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 95,430 parts In-Stock

1+ parts

-

100+ parts

$0.436

1k+ parts

$0.362

10k+ parts

$0.323

95,430

-

$0.436

$0.362

$0.323

Farnell

UK . 95,430 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.434

10k+ parts

-

95,430

-

-

$0.434

-

DigiKey

USA . 95,430 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.370

10k+ parts

-

95,430

-

-

$0.370

-

Verical

USA . 72,930 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.452

10k+ parts

$0.403

72,930

-

-

$0.452

$0.403

Flip Electronics (Authorized)

USA . 34,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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34,480

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,009 parts In-Stock

1+ parts

$0.339

100+ parts

-

1k+ parts

-

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1,009

$0.339

-

-

-

Vyrian

USA . 1,274 parts In-Stock

1+ parts

$0.357

100+ parts

-

1k+ parts

-

10k+ parts

-

1,274

$0.357

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$9.627

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$9.627

-

-

-

Flip Electronics

USA . 34,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

34,480

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,179 parts In-Stock

1+ parts

$0.321

100+ parts

-

1k+ parts

-

10k+ parts

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2,179

$0.321

-

-

-

Vigor

Singapore . 387 parts In-Stock

1+ parts

$0.340

100+ parts

-

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10k+ parts

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387

$0.340

-

-

-

Corohmni

South Africa . 157 parts In-Stock

1+ parts

$0.357

100+ parts

-

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10k+ parts

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157

$0.357

-

-

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Continental Prestige Electronics

USA . 72,930 parts In-Stock

1+ parts

-

100+ parts

$0.430

1k+ parts

-

10k+ parts

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72,930

-

$0.430

-

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Kulean Microsystems

USA . 7,249 parts In-Stock

1+ parts

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7,249

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Problanco Electronics

Mexico . 6,694 parts In-Stock

1+ parts

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6,694

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TANS Electronics

Latvia . 5,473 parts In-Stock

1+ parts

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5,473

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SupplyDigital Components

Austria . 3,497 parts In-Stock

1+ parts

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3,497

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Microchip USA

USA . 2,651 parts In-Stock

1+ parts

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2,651

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UHIMA Technologies

Türkiye . 559 parts In-Stock

1+ parts

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100+ parts

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559

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Overview

Enhance your electronic designs with the NLV74HC125ADTR2G by Onsemi, a top-quality bus driver & transceiver that delivers unmatched performance and reliability. With Onsemi's reputation for excellence in semiconductor manufacturing, this versatile component is perfect for a wide range of applications. From automotive to industrial electronics, this product offers customers exceptional value, efficiency, and precision. Trust Onsemi to provide the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and lightweight design, making it suitable for various applications.

Propagation Delay At Nominal Supply: 27 ns

With a low propagation delay, this product ensures fast and efficient data transmission, enhancing overall performance.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes it compatible with many systems and simplifies power management.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim package style saves space on the PCB and allows for dense mounting of components.

Output Characteristics: 3-STATE

The 3-STATE output allows for tristate control, enabling flexibility in driving multiple bus lines efficiently.

Temperature Grade: MILITARY

Designed to meet military temperature specifications, ensuring reliability and performance in harsh environmental conditions.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems.

Technical Specifications

Bus Driver & Transceivers NLV74HC125ADTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLV74HC125ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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