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NLV74HC240ADTR2G

Onsemi

NLV74HC240ADTR2G by Onsemi

NLV74HC240ADTR2G by Onsemi is a 20-terminal bus driver with 4-bit capacity and 120 ns propagation delay. Operating b/w -55 to 125 °C, it features CMOS technology and inverted output polarity. Ideal for military-grade applications requiring small outline packaging and dual terminal position.

Median Price

$0.399

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

$0.392

1k+ parts

$0.326

10k+ parts

$0.290

15,000

-

$0.392

$0.326

$0.290

Verical

USA . 15,000 parts In-Stock

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$0.406

10k+ parts

$0.362

15,000

-

-

$0.406

$0.362

Distributors (In-Stock)

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Flip Electronics

USA . 10,000 parts In-Stock

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Vyrian

USA . 8,313 parts In-Stock

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Digiode

USA . 170 parts In-Stock

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Vigor

Singapore . 322 parts In-Stock

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$0.330

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322

$0.330

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AZTECH Wire

Italy . 942 parts In-Stock

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$10.680

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942

$10.680

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TANS Electronics

Latvia . 6,297 parts In-Stock

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SupplyDigital Components

Austria . 3,725 parts In-Stock

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Kulean Microsystems

USA . 2,894 parts In-Stock

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Problanco Electronics

Mexico . 2,691 parts In-Stock

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Corphita

USA . 1,807 parts In-Stock

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UHIMA Technologies

Türkiye . 815 parts In-Stock

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Microchip USA

USA . 785 parts In-Stock

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Corohmni

South Africa . 417 parts In-Stock

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Overview

Unlock the power of efficient data transmission with the NLV74HC240ADTR2G by Onsemi. This high-quality bus driver and transceiver offers cutting-edge technology and reliable performance, making it a top choice for a variety of applications. With its innovative design and advanced features, customers can enjoy seamless communication and enhanced functionality. Trust Onsemi to deliver exceptional value and unparalleled benefits with the NLV74HC240ADTR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to physical damage, making it suitable for rugged environments.

Surface Mount: YES

Ease of installation and space-saving design, making it suitable for compact electronic devices.

No. of Functions: 2

Provides multiple functions in a single component, reducing the need for additional components and simplifying the design.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a common supply voltage, ensuring compatibility with various systems.

Propagation Delay (tpd): 120 ns

Fast signal propagation time for efficient data transfer and communication.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices, making it a versatile choice for bus drivers and transceivers.

Technical Specifications

Bus Driver & Transceivers NLV74HC240ADTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

120 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLV74HC240ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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