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NLV74HC125ADR2G

Onsemi

NLV74HC125ADR2G by Onsemi

NLV74HC125ADR2G by Onsemi is a 4-function bus driver with 27ns propagation delay at 5V. It operates in the temperature range of -55 to 125 °C, suitable for military applications. With a small outline package style and dual terminal position, it offers true output polarity and 3-STATE characteristics.

Median Price

$0.152

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 28,679 parts In-Stock

1+ parts

-

100+ parts

$0.164

1k+ parts

$0.136

10k+ parts

$0.121

28,679

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$0.164

$0.136

$0.121

DigiKey

USA . 28,679 parts In-Stock

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$0.140

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$0.140

Verical

USA . 21,525 parts In-Stock

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$0.152

21,525

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$0.152

Distributors (In-Stock)

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Vyrian

USA . 168 parts In-Stock

1+ parts

$0.106

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168

$0.106

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Digiode

USA . 1,977 parts In-Stock

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$0.127

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$0.127

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ComSIT Distribution GmbH

Germany . 1,100 parts In-Stock

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ComSIT USA

USA . 1,100 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 195 parts In-Stock

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$0.106

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195

$0.106

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Corphita

USA . 2,003 parts In-Stock

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$0.121

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2,003

$0.121

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Vigor

Singapore . 527 parts In-Stock

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$0.310

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527

$0.310

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Microchip USA

USA . 6,806 parts In-Stock

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$0.845

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$0.845

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Continental Prestige Electronics

USA . 28,886 parts In-Stock

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$0.161

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TANS Electronics

Latvia . 8,114 parts In-Stock

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Problanco Electronics

Mexico . 5,738 parts In-Stock

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Kulean Microsystems

USA . 5,169 parts In-Stock

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SupplyDigital Components

Austria . 3,584 parts In-Stock

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UHIMA Technologies

Türkiye . 651 parts In-Stock

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651

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Overview

Unleash the power of innovation with the NLV74HC125ADR2G by Onsemi, a cutting-edge Bus Driver & Transceiver that sets the standard for quality and reliability. Manufactured with precision and expertise, this product offers unparalleled performance in a wide range of applications. From its advanced technology to its robust design, customers can trust in the value and benefits that this product provides. Elevate your projects to new heights with the NLV74HC125ADR2G and experience the advantages that only Onsemi can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for long-lasting performance.

Propagation Delay At Nominal Supply: 27 ns

Provides fast response time for efficient data transmission.

Surface Mount: YES

Easy installation on circuit boards for convenient usage.

No. of Functions: 4

Offers versatility in functionality for multiple applications.

Nominal Supply Voltage / Vsup (V): 5

Compatible with common power supply voltages for seamless integration.

Load Capacitance (CL): 50 pF

Optimized for handling capacitance to ensure signal integrity.

Output Characteristics: 3-STATE

Allows for high impedance output state for flexibility in signal routing.

Temperature Grade: MILITARY

Meets stringent military standards for reliability and performance in harsh conditions.

Technical Specifications

Bus Driver & Transceivers NLV74HC125ADR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV74HC125ADR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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