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NLV74FST3257DR2G

Onsemi

NLV74FST3257DR2G by Onsemi

NLV74FST3257DR2G by Onsemi is a 4-function bus driver with 0.25 ns propagation delay, suitable for industrial applications. It operates at 4-5.5 V with -40 to 85°C temperature range and supports bidirectional communication. The small outline package has 16 terminals, making it ideal for compact designs requiring fast signal transmission.

Median Price

$0.402

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,270 parts In-Stock

1+ parts

$0.660

100+ parts

$0.369

1k+ parts

$0.316

10k+ parts

-

4,270

$0.660

$0.369

$0.316

-

Rochester

USA . 18,426 parts In-Stock

1+ parts

-

100+ parts

$0.357

1k+ parts

$0.297

10k+ parts

$0.264

18,426

-

$0.357

$0.297

$0.264

Verical

USA . 11,974 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.402

10k+ parts

$0.331

11,974

-

-

$0.402

$0.331

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,477 parts In-Stock

1+ parts

$0.230

100+ parts

-

1k+ parts

-

10k+ parts

-

2,477

$0.230

-

-

-

Digiode

USA . 1,639 parts In-Stock

1+ parts

$0.278

100+ parts

-

1k+ parts

-

10k+ parts

-

1,639

$0.278

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 401 parts In-Stock

1+ parts

$0.230

100+ parts

-

1k+ parts

-

10k+ parts

-

401

$0.230

-

-

-

Corphita

USA . 1,307 parts In-Stock

1+ parts

$0.264

100+ parts

-

1k+ parts

-

10k+ parts

-

1,307

$0.264

-

-

-

Vigor

Singapore . 148 parts In-Stock

1+ parts

$0.660

100+ parts

-

1k+ parts

-

10k+ parts

-

148

$0.660

-

-

-

Aztec Data Supply Inc.

USA . 33 parts In-Stock

1+ parts

$13.580

100+ parts

-

1k+ parts

-

10k+ parts

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33

$13.580

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 25,894 parts In-Stock

1+ parts

-

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25,894

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Perfect Parts

USA . 18,366 parts In-Stock

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18,366

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Continental Prestige Electronics

USA . 16,974 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.350

10k+ parts

-

16,974

-

-

$0.350

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SupplyDigital Components

Austria . 5,851 parts In-Stock

1+ parts

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100+ parts

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5,851

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Problanco Electronics

Mexico . 5,648 parts In-Stock

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5,648

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Microchip USA

USA . 3,750 parts In-Stock

1+ parts

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3,750

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Authorized Procurement Solutions

USA . 2,358 parts In-Stock

1+ parts

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2,358

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TANS Electronics

Latvia . 2,127 parts In-Stock

1+ parts

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2,127

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Kulean Microsystems

USA . 1,138 parts In-Stock

1+ parts

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100+ parts

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1,138

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-

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UHIMA Technologies

Türkiye . 692 parts In-Stock

1+ parts

-

100+ parts

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692

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-

Overview

Unlock the power of seamless data transmission with the NLV74FST3257DR2G by Onsemi. Crafted with precision and expertise, this bus driver & transceiver is designed to deliver unmatched quality and reliability. Ideal for a wide range of applications, this product offers customers a seamless experience with its advanced features and superior performance. Trust Onsemi to provide you with a product that exceeds expectations, ensuring optimal efficiency and value for your projects. Elevate your connectivity with the NLV74FST3257DR2G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 0.25 ns

Allows for fast signal transmission, making the bus driver efficient in data communication.

Surface Mount: YES

Easily mountable on PCBs, making it convenient for integration into electronic systems.

No. of Functions: 4

Provides flexibility and versatility in signal processing and control within the bus driver.

Screening Level: AEC-Q100

Meets automotive quality standards, ensuring reliability and performance in harsh environmental conditions.

Package Shape: RECTANGULAR

Space-efficient design for easy integration into compact electronic devices or systems.

Nominal Supply Voltage / Vsup (V): 4.5

Operates efficiently at a standard voltage level, ensuring compatibility with various power sources.

Load Capacitance (CL): 50 pF

Suitable for driving moderate loads in electronic circuits, providing stability in signal transmission.

Output Characteristics: 3-STATE

Allows for high impedance output state, enabling multiple drivers to share a common bus line.

Technology: CMOS

Utilizes low power consumption and high noise immunity, enhancing the efficiency and reliability of the bus driver.

Technical Specifications

Bus Driver & Transceivers NLV74FST3257DR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Ports:

3

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.25 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV74FST3257DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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