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NLV74ACT244DWR2G

Onsemi

NLV74ACT244DWR2G by Onsemi

NLV74ACT244DWR2G by Onsemi is a 4-bit bus driver with 10ns propagation delay. Operating b/w -40 to 85 °C, it has a supply voltage range of 4.5-5.5V and features TRUE output polarity. Ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

$0.492

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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$0.492

10k+ parts

$0.452

1,000

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-

$0.492

$0.452

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 21,000 parts In-Stock

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Vyrian

USA . 8,820 parts In-Stock

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Digiode

USA . 1,344 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 136 parts In-Stock

1+ parts

$0.320

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136

$0.320

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Corohmni

South Africa . 365 parts In-Stock

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$1.110

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365

$1.110

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Microchip USA

USA . 2,116 parts In-Stock

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$3.452

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TANS Electronics

Latvia . 8,326 parts In-Stock

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Kulean Microsystems

USA . 7,112 parts In-Stock

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SupplyDigital Components

Austria . 3,222 parts In-Stock

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Problanco Electronics

Mexico . 3,000 parts In-Stock

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Corphita

USA . 1,574 parts In-Stock

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UHIMA Technologies

Türkiye . 200 parts In-Stock

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Overview

Unlock a world of possibilities with the NLV74ACT244DWR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality bus driver & transceivers like no other. This product offers unparalleled value and benefits, making it an essential component for a wide range of applications. With its innovative design and reliable performance, customers can trust in the NLV74ACT244DWR2G to deliver outstanding results every time. Upgrade your projects today with this superior solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and resilience, making the product suitable for rugged environments.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and facilitating mass production.

No. of Functions: 2

Having multiple functions in a single component streamlines circuit design and reduces overall system complexity.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal voltage of 5V ensures compatibility with common power sources and other components.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding operational conditions without compromising performance.

Output Characteristics: 3-STATE

The 3-STATE output feature allows the driver/transceiver to switch between high impedance and active drive states, offering flexibility in signal control.

Technology: CMOS

Utilizing CMOS technology results in low power consumption, high noise immunity, and compatibility with a wide range of systems.

Technical Specifications

Bus Driver & Transceivers NLV74ACT244DWR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

10 ns

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

NLV74ACT244DWR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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