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NLV74HC244ADTR2G

Onsemi

NLV74HC244ADTR2G by Onsemi

NLV74HC244ADTR2G by Onsemi is a 4-bit bus driver with 27ns propagation delay, suitable for military applications. It operates at supply voltages of 2-6V, has a max operating temperature of 125 °C, and features a small outline package style.

Median Price

$0.406

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,955 parts In-Stock

1+ parts

$0.870

100+ parts

$0.548

1k+ parts

$0.338

10k+ parts

-

1,955

$0.870

$0.548

$0.338

-

Rochester

USA . 3,356 parts In-Stock

1+ parts

-

100+ parts

$0.391

1k+ parts

$0.325

10k+ parts

$0.290

3,356

-

$0.391

$0.325

$0.290

Verical

USA . 1,757 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.406

10k+ parts

$0.362

1,757

-

-

$0.406

$0.362

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 871 parts In-Stock

1+ parts

$0.305

100+ parts

-

1k+ parts

-

10k+ parts

-

871

$0.305

-

-

-

Vyrian

USA . 244 parts In-Stock

1+ parts

$0.321

100+ parts

-

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10k+ parts

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244

$0.321

-

-

-

Flip Electronics

USA . 51,834 parts In-Stock

1+ parts

-

100+ parts

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51,834

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,836 parts In-Stock

1+ parts

$0.289

100+ parts

-

1k+ parts

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10k+ parts

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1,836

$0.289

-

-

-

Vigor

Singapore . 447 parts In-Stock

1+ parts

$0.320

100+ parts

-

1k+ parts

-

10k+ parts

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447

$0.320

-

-

-

Corohmni

South Africa . 174 parts In-Stock

1+ parts

$0.321

100+ parts

-

1k+ parts

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174

$0.321

-

-

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Microchip USA

USA . 2,579 parts In-Stock

1+ parts

$5.980

100+ parts

-

1k+ parts

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10k+ parts

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2,579

$5.980

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Perfect Parts

USA . 6,955 parts In-Stock

1+ parts

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100+ parts

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6,955

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SupplyDigital Components

Austria . 5,569 parts In-Stock

1+ parts

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5,569

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Problanco Electronics

Mexico . 5,494 parts In-Stock

1+ parts

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5,494

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TANS Electronics

Latvia . 882 parts In-Stock

1+ parts

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882

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UHIMA Technologies

Türkiye . 680 parts In-Stock

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680

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Kulean Microsystems

USA . 667 parts In-Stock

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667

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Overview

Unlock seamless communication and unparalleled performance with the NLV74HC244ADTR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch Bus Driver & Transceivers that guarantee reliability and precision. Ideal for a wide range of applications, this product boasts a fast propagation delay and 3-STATE output characteristics. With a compact design and high-quality materials, it ensures optimal functionality while maximizing efficiency. Experience the value and benefits of Onsemi's NLV74HC244ADTR2G - where quality meets innovation for unparalleled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, ideal for use in automotive applications.

Propagation Delay At Nominal Supply: 27 ns

The low propagation delay ensures fast and efficient data transmission, making the product suitable for high-speed communication systems.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in one device helps in simplifying circuit design and reducing the overall component count, leading to cost savings.

Screening Level: AEC-Q100

The AEC-Q100 screening level indicates that the product meets automotive industry quality standards and is suitable for use in automotive applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard voltage levels used in electronic systems, making integration easier.

Load Capacitance (CL): 50 pF

The low load capacitance helps in minimizing signal distortion and ensuring reliable data transmission over long distances.

Power Supplies (V): 2/6

Having multiple power supply options (2V and 6V) provides flexibility in designing and configuring the system for different voltage requirements.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for high impedance output, enabling multiple devices to share a common bus without bus contention issues.

Temperature Grade: MILITARY

The military-grade temperature rating ensures the product can withstand harsh environmental conditions, making it suitable for rugged applications.

Technical Specifications

Bus Driver & Transceivers NLV74HC244ADTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLV74HC244ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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