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NLV74HC240ADWG

Onsemi

NLV74HC240ADWG by Onsemi

NLV74HC240ADWG by Onsemi is a 20-terminal CMOS bus driver with 4 bits, operating at -55 to 125 °C. It has a propagation delay of 120 ns and supports inverted output polarity. Ideal for military-grade applications requiring small outline packages and surface mount technology.

Median Price

$0.411

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 30,020 parts In-Stock

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$0.290

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Flip Electronics (Authorized)

USA . 30,020 parts In-Stock

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Rochester

USA . 1,330 parts In-Stock

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$0.411

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$0.341

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$0.304

1,330

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$0.411

$0.341

$0.304

Verical

USA . 1,330 parts In-Stock

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$0.426

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$0.380

1,330

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$0.380

Distributors (In-Stock)

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Vyrian

USA . 203 parts In-Stock

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$0.290

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Digiode

USA . 1,007 parts In-Stock

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$0.320

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Flip Electronics

USA . 30,020 parts In-Stock

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Corohmni

South Africa . 465 parts In-Stock

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$0.290

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Corphita

USA . 1,198 parts In-Stock

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$0.303

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Vigor

Singapore . 879 parts In-Stock

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$0.320

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Component Stockers USA

USA . 1,137 parts In-Stock

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$0.350

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$0.330

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$0.300

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QUARKTWIN TECHNOLOGY LTD

USA . 10,247 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 7,323 parts In-Stock

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Problanco Electronics

Mexico . 6,569 parts In-Stock

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SupplyDigital Components

Austria . 4,037 parts In-Stock

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Continental Prestige Electronics

USA . 1,330 parts In-Stock

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UHIMA Technologies

Türkiye . 555 parts In-Stock

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Microchip USA

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TANS Electronics

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Overview

Enhance your circuit designs with the NLV74HC240ADWG by Onsemi, a top-tier manufacturer known for delivering high-quality bus drivers and transceivers. This versatile component offers 3-state output characteristics, inverted polarity, and a propagation delay of just 120 ns, making it perfect for a wide range of applications. From industrial automation to consumer electronics, this small outline package provides reliability, performance, and value. Upgrade your projects today with the NLV74HC240ADWG from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Surface mount feature makes it easier to integrate into PCB designs.

No. of Functions: 2

Having 2 functions in one component saves space and simplifies circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, compatible with many systems.

Propagation Delay (tpd): 120 ns

Fast propagation delay ensures quick signal transmission.

Output Characteristics: 3-STATE

3-state output allows for flexible control of signal flow.

Temperature Grade: MILITARY

Military-grade temperature range ensures performance in harsh operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Bus Driver & Transceivers NLV74HC240ADWG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

120 ns

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

NLV74HC240ADWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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