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NLV74HCT573ADWG

Onsemi

NLV74HCT573ADWG by Onsemi

NLV74HCT573ADWG by Onsemi is an 8-bit bus driver with 3-STATE output, operating at a supply voltage range of 4.5V to 5.5V. It features a low propagation delay of 45ns and can withstand temperatures from -55 °C to 125°C. Ideal for military-grade applications requiring high-speed data transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,149 parts In-Stock

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Digiode

USA . 443 parts In-Stock

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AZTECH Wire

Italy . 1,105 parts In-Stock

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$9.380

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Component Stockers USA

USA . 490 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 24,681 parts In-Stock

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Problanco Electronics

Mexico . 7,659 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 4,955 parts In-Stock

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Microchip USA

USA . 4,191 parts In-Stock

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SupplyDigital Components

Austria . 3,701 parts In-Stock

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Kulean Microsystems

USA . 1,439 parts In-Stock

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Corphita

USA . 991 parts In-Stock

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UHIMA Technologies

Türkiye . 308 parts In-Stock

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Vigor

Singapore . 175 parts In-Stock

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Corohmni

South Africa . 109 parts In-Stock

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Overview

Revolutionize your electronic projects with the NLV74HCT573ADWG by Onsemi, a top-tier manufacturer known for their high-quality components. This 8-bit bus driver & transceiver is designed to deliver seamless performance and reliability in a wide range of applications. With a small outline package style and true output polarity, this product offers customers unmatched value and benefits. Say goodbye to connectivity issues and hello to innovation with the NLV74HCT573ADWG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection against external elements, making this product suitable for rugged environments.

Surface Mount: YES

Surface mount technology allows for easier installation and space-saving on PCBs, enhancing overall product efficiency.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and stable performance.

Propagation Delay (tpd): 45 ns

Low propagation delay of 45 ns enables fast signal transmission and response times in data communication applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125 °C allows for reliable functioning in various temperature conditions without risk of overheating.

Width: 7.5 mm

Compact width of 7.5 mm facilitates space-efficient PCB layout and integration, ideal for designs with limited space.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Bus Driver & Transceivers NLV74HCT573ADWG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

45 ns

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

NLV74HCT573ADWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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