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NLV14584BDG

Onsemi

NLV14584BDG by Onsemi

NLV14584BDG by Onsemi is a 6-function logic gate with 250ns propagation delay. Operating b/w -55 to 125 °C, it has a supply voltage range of 3-18V. Ideal for military-grade applications requiring high-speed signal processing in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,849 parts In-Stock

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Digiode

USA . 591 parts In-Stock

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Vigor

Singapore . 141 parts In-Stock

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$0.330

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AZTECH Wire

Italy . 980 parts In-Stock

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$10.650

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980

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Kulean Microsystems

USA . 2,945 parts In-Stock

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SupplyDigital Components

Austria . 2,878 parts In-Stock

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Problanco Electronics

Mexico . 2,312 parts In-Stock

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UHIMA Technologies

Türkiye . 907 parts In-Stock

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Corphita

USA . 539 parts In-Stock

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TANS Electronics

Latvia . 178 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 103 parts In-Stock

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Overview

Unleash the power of innovation with the NLV14584BDG logic gates by Onsemi. Crafted with precision and expertise, this product embodies the commitment to quality that Onsemi is known for. Perfect for a wide range of applications, these logic gates offer unparalleled performance and reliability. Whether you're a seasoned professional or a hobbyist, the NLV14584BDG provides unbeatable value, benefits, and advantages, making it a must-have in your toolkit. Upgrade your projects today and experience the difference with Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

No. of Functions: 6

Having 6 functions in one component offers versatility and flexibility in designing circuits.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is a common voltage level in many electronic systems, making this product compatible with a wide range of applications.

Propagation Delay (tpd): 250 ns

With a low propagation delay of 250ns, this logic gate ensures fast and efficient signal processing in electronic circuits.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C allows the product to withstand harsh environmental conditions and maintain reliability.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C ensures the product can function properly even in extreme cold conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Logic Gates NLV14584BDG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

250 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV14584BDG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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