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NLV14071BDG

Onsemi

NLV14071BDG by Onsemi

NLV14071BDG by Onsemi is a CMOS Logic Gates IC with 4 functions, 2 inputs, and 300ns propagation delay at 5V. It operates in a temperature range of -55 to 125 °C and is suitable for military-grade applications requiring AEC-Q100 screening.

Median Price

$0.243

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 45 parts In-Stock

1+ parts

-

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$0.243

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$0.201

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$0.180

45

-

$0.243

$0.201

$0.180

Distributors (In-Stock)

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Digiode

USA . 359 parts In-Stock

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$0.228

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$0.228

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Vyrian

USA . 4,033 parts In-Stock

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4,033

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Ampacity Inc.

Singapore . 30 parts In-Stock

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$0.204

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30

$0.204

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Corphita

USA . 1,380 parts In-Stock

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$0.216

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Vigor

Singapore . 578 parts In-Stock

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$0.240

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578

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Corohmni

South Africa . 130 parts In-Stock

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$0.240

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130

$0.240

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AZTECH Wire

Italy . 811 parts In-Stock

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$16.810

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QUARKTWIN TECHNOLOGY LTD

USA . 29,067 parts In-Stock

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Microchip USA

USA . 6,927 parts In-Stock

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Problanco Electronics

Mexico . 6,724 parts In-Stock

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SupplyDigital Components

Austria . 4,218 parts In-Stock

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TANS Electronics

Latvia . 3,591 parts In-Stock

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Kulean Microsystems

USA . 3,002 parts In-Stock

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UHIMA Technologies

Türkiye . 723 parts In-Stock

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Overview

Discover the NLV14071BDG by Onsemi, a high-quality Logic Gates product that boasts reliability and precision. Manufactured by Onsemi, a trusted industry leader, this versatile component is ideal for a wide range of applications. Experience superior performance and seamless integration with a nominal supply voltage of 5V and a maximum operating temperature of 125 °C. With its compact design and advanced technology, the NLV14071BDG offers customers exceptional value, efficiency, and peace of mind. Elevate your projects with this innovative solution from Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the logic gates, ensuring a longer lifespan.

Propagation Delay at Nominal Supply: 300 ns

The low propagation delay ensures fast signal processing and response times, making this product ideal for time-sensitive applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration on circuit boards, saving space and simplifying assembly.

No. of Functions: 4

Having multiple functions in a single component reduces the overall component count and complexity of the circuit design.

Screening Level: AEC-Q100

This screening level ensures that the logic gates meet automotive-grade standards for reliability and performance in harsh environments.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is a common and easily accessible power source, making these logic gates compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

The low load capacitance helps minimize signal distortion and improve signal integrity, especially in high-frequency applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making these logic gates energy-efficient and reliable in noisy environments.

Technical Specifications

Logic Gates NLV14071BDG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

300 ns

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV14071BDG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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