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NL27WZ17MU1TCG

Onsemi

NL27WZ17MU1TCG by Onsemi

NL27WZ17MU1TCG by Onsemi is a Logic Gate with 2 functions, 9.5ns propagation delay, and 15.6ns tpd. Ideal for military-grade applications due to its CMOS technology and Schmitt Trigger feature. With a small outline package style and surface mount capability, it operates b/w -55°C to 125°C efficiently.

Median Price

$0.088

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,312 parts In-Stock

1+ parts

$0.088

100+ parts

$0.083

1k+ parts

$0.075

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2,312

$0.088

$0.083

$0.075

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Flip Electronics (Authorized)

USA . 66,000 parts In-Stock

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66,000

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Digiode

USA . 2,238 parts In-Stock

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$0.084

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2,238

$0.084

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Flip Electronics

USA . 66,000 parts In-Stock

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66,000

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Vyrian

USA . 7,888 parts In-Stock

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7,888

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Semicontronic

India . 23,646 parts In-Stock

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$0.075

100+ parts

$0.073

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$0.073

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23,646

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$0.073

$0.073

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Ampacity Inc.

Singapore . 23,543 parts In-Stock

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$0.075

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Corphita

USA . 1,087 parts In-Stock

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$0.079

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Corohmni

South Africa . 220 parts In-Stock

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$0.088

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220

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Aztec Data Supply Inc.

USA . 3,176 parts In-Stock

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$11.700

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Kulean Microsystems

USA . 7,375 parts In-Stock

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Continental Prestige Electronics

USA . 6,715 parts In-Stock

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Problanco Electronics

Mexico . 3,875 parts In-Stock

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Argo Parts USA

USA . 2,477 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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TANS Electronics

Latvia . 716 parts In-Stock

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UHIMA Technologies

Türkiye . 533 parts In-Stock

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SupplyDigital Components

Austria . 438 parts In-Stock

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Microchip USA

USA . 299 parts In-Stock

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Overview

Enhance your electronic projects with the NL27WZ17MU1TCG logic gates from Onsemi. Known for their superior quality and reliability, Onsemi products are trusted by professionals worldwide. Whether you're working on industrial automation, consumer electronics, or automotive applications, these logic gates offer fast propagation delay and low power consumption, ensuring efficient performance. With a compact design and military-grade temperature tolerance, the NL27WZ17MU1TCG is the perfect choice for demanding environments. Upgrade your circuits today and experience the benefits of Onsemi's cutting-edge technology.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 9.5 ns

Fast propagation delay ensures efficient signal processing, making this logic gate a reliable choice for high-speed applications.

Surface Mount: YES

Surface mount compatibility allows for easy and secure installation on PCBs, increasing convenience and reliability of the product.

No. of Functions: 2

Offering multiple functions in one package saves space on the board, making this logic gate an efficient choice for compact designs.

Package Shape: RECTANGULAR

The rectangular shape provides versatility in mounting options and easy integration into various electronic systems.

Nominal Supply Voltage / Vsup (V): 2.3

The optimal supply voltage ensures stable performance and efficient power consumption, making this logic gate a cost-effective choice.

Load Capacitance (CL): 50 pF

With a moderate load capacitance, this logic gate can handle a variety of loads without compromising signal integrity.

No. of Terminals: 6

The moderate number of terminals enables easy connectivity and integration into existing circuitry, making this logic gate user-friendly.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile make this logic gate suitable for space-constrained applications while maintaining high performance.

Maximum I (ol): 32 Amp

With a high maximum output current, this logic gate can drive heavy loads effectively, making it suitable for demanding applications.

Propagation Delay (tpd): 15.6 ns

The moderate propagation delay ensures efficient signal processing, making this logic gate a dependable choice for various applications.

Technical Specifications

Logic Gates NL27WZ17MU1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-XDSO-N6

Length:

1.45 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

15.6 ns

Schmitt Trigger:

YES

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL SILVER GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NL27WZ17MU1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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