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NL27WZ06DTT1G

Onsemi

NL27WZ06DTT1G by Onsemi

NL27WZ06DTT1G by Onsemi is a CMOS Logic Gate with 2 functions, Vsup ranging from 1.65V to 5.5V, and tpd of 11ns. Ideal for military applications due to its MILITARY grade, OPEN-DRAIN output characteristics, and small form factor package style.

Median Price

$0.322

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,278 parts In-Stock

1+ parts

$0.560

100+ parts

$0.197

1k+ parts

$0.132

10k+ parts

$0.100

1,278

$0.560

$0.197

$0.132

$0.100

Mouser Electronics

USA . 2,663 parts In-Stock

1+ parts

-

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$0.085

2,663

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$0.085

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.122

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-

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10

$0.122

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Digiode

USA . 794 parts In-Stock

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$0.532

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794

$0.532

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Cyclops Electronics Ltd

UK . 39,000 parts In-Stock

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39,000

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Chip Stock

USA . 35,000 parts In-Stock

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Flip Electronics

USA . 8,890 parts In-Stock

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Vyrian

USA . 1,725 parts In-Stock

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1,725

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,024 parts In-Stock

1+ parts

$0.072

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-

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2,024

$0.072

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Semicontronic

India . 1,762 parts In-Stock

1+ parts

$0.072

100+ parts

$0.070

1k+ parts

$0.070

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-

1,762

$0.072

$0.070

$0.070

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Corohmni

South Africa . 449 parts In-Stock

1+ parts

$0.085

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449

$0.085

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$0.119

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$0.115

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1,000

$0.119

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$0.115

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Argo Parts USA

USA . 4,345 parts In-Stock

1+ parts

$0.122

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$0.118

4,345

$0.122

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$0.118

Continental Prestige Electronics

USA . 2,380 parts In-Stock

1+ parts

$0.343

100+ parts

$0.130

1k+ parts

$0.086

10k+ parts

$0.068

2,380

$0.343

$0.130

$0.086

$0.068

Component Stockers USA

USA . 5,227 parts In-Stock

1+ parts

$0.360

100+ parts

$0.180

1k+ parts

$0.100

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5,227

$0.360

$0.180

$0.100

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Vigor

Singapore . 167 parts In-Stock

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$0.480

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167

$0.480

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Corphita

USA . 1,388 parts In-Stock

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$0.504

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1,388

$0.504

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Microchip USA

USA . 236 parts In-Stock

1+ parts

$29.250

100+ parts

$29.160

1k+ parts

$29.160

10k+ parts

$29.070

236

$29.250

$29.160

$29.160

$29.070

GreenTree Electronics

Israel . 27,000 parts In-Stock

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Perfect Parts

USA . 11,977 parts In-Stock

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Problanco Electronics

Mexico . 5,844 parts In-Stock

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SupplyDigital Components

Austria . 4,214 parts In-Stock

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Lixinc

USA . 2,990 parts In-Stock

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Kulean Microsystems

USA . 2,880 parts In-Stock

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TANS Electronics

Latvia . 1,099 parts In-Stock

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UHIMA Technologies

Türkiye . 221 parts In-Stock

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Overview

Upgrade your electronic designs with the NL27WZ06DTT1G by Onsemi - a top-quality logic gate that offers unmatched performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this logic gate is perfect for a wide range of applications. With its advanced features and robust design, this product delivers superior functionality and efficiency to meet your project needs. Say goodbye to worries about compatibility and performance issues - choose the NL27WZ06DTT1G for exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

No. of Functions: 2

Provides versatility and capability for performing multiple logic operations.

Nominal Supply Voltage (Vsup): 1.8V

Operates efficiently at low voltage levels, reducing power consumption.

Propagation Delay (tpd): 11 ns

Fast propagation delay ensures quick response times in logic operations.

Temperature Grade: MILITARY

Designed to operate reliably in extreme temperature conditions, suitable for military applications.

Technical Specifications

Logic Gates NL27WZ06DTT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

27WZ

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

NL27WZ06DTT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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