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NL27WZ16DFT2G

Onsemi

NL27WZ16DFT2G by Onsemi

NL27WZ16DFT2G by Onsemi is a Logic Gates IC with 2 functions, Vsup range of 1.65V to 5.5V, and tpd of 10.2ns. Ideal for military-grade applications due to its -55°C to 125°C operating temperature range and small outline package style. This CMOS technology device is suitable for high-speed digital circuits requiring low power consumption.

Median Price

$0.031

Lifecycle Status

Suppliers In-Stock

34

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 10 parts In-Stock

1+ parts

$0.018

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10

$0.018

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DigiKey

USA . 19,505 parts In-Stock

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$0.100

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$0.038

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$0.030

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19,505

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EBV Elektronik

Germany . 366,000 parts In-Stock

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Avnet

USA . 234,000 parts In-Stock

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Future Electronics

Canada . 42,000 parts In-Stock

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Chip1Stop

Japan . 24,000 parts In-Stock

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Arrow

USA . 15,000 parts In-Stock

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Verical

USA . 15,000 parts In-Stock

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Rochester

USA . 14,634 parts In-Stock

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$0.031

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$0.026

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$0.023

14,634

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$0.031

$0.026

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Farnell

UK . 3,644 parts In-Stock

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$0.031

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$0.025

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$0.023

3,644

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$0.031

$0.025

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Element14

Singapore . 3,644 parts In-Stock

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$0.041

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$0.039

3,644

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$0.039

Distributors (In-Stock)

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Digiode

USA . 1,467 parts In-Stock

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$0.024

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Nova Conductors

Japan . 97 parts In-Stock

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$0.081

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97

$0.081

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TME

Poland . 2,754 parts In-Stock

1+ parts

$0.090

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$0.035

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$0.031

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2,754

$0.090

$0.035

$0.031

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Bristol Electronics

USA . 2,174 parts In-Stock

1+ parts

$0.135

100+ parts

$0.068

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$0.027

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2,174

$0.135

$0.068

$0.027

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Maritex

Poland . 3,021 parts In-Stock

1+ parts

$0.274

100+ parts

$0.063

1k+ parts

$0.041

10k+ parts

$0.035

3,021

$0.274

$0.063

$0.041

$0.035

IBS Electronics

USA . 585,000 parts In-Stock

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Chip Stock

USA . 442,368 parts In-Stock

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NAC Semi

USA . 120,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 13,873 parts In-Stock

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Semtec, LLC

USA . 9,377 parts In-Stock

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Vyrian

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Semi Source

USA . 3,680 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

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R&J Components

USA . 2,925 parts In-Stock

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Holdelec - ElecDif-Pro

France . 1,794 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 948 parts In-Stock

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Prism Electronics

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Atlantic Semiconductor

USA . 600 parts In-Stock

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LWI Electronics Inc

India . 480 parts In-Stock

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North Shore Components

USA . 140 parts In-Stock

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NPI Materials, Inc.

USA . 35 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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Distributors (Availability)

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Ampacity Inc.

Singapore . 8,631 parts In-Stock

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$0.021

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Corphita

USA . 567 parts In-Stock

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Corohmni

South Africa . 429 parts In-Stock

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Semicontronic

India . 10,917 parts In-Stock

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$0.044

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$0.043

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$0.043

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$0.044

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Argo Parts USA

USA . 4,072 parts In-Stock

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$0.081

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$0.078

4,072

$0.081

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$0.078

Continental Prestige Electronics

USA . 3,258 parts In-Stock

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$0.081

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$0.079

3,258

$0.081

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$0.079

Netroflash

USA . 2,000 parts In-Stock

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$0.081

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$0.081

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Vigor

Singapore . 849 parts In-Stock

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$0.370

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849

$0.370

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Microchip USA

USA . 217 parts In-Stock

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$0.413

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217

$0.413

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Component Stockers USA

USA . 104,042 parts In-Stock

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$0.710

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104,042

$0.710

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Advanced Electronics

New Zealand . 60 parts In-Stock

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$13.592

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$12.912

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$12.912

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60

$13.592

$12.912

$12.912

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Aztec Data Supply Inc.

USA . 1,747 parts In-Stock

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$29.940

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Perfect Parts

USA . 726,870 parts In-Stock

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RC Electronics

USA . 115,947 parts In-Stock

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Formix International (Excess)

India . 59,261 parts In-Stock

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S.R.D Solutions

India . 42,000 parts In-Stock

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Futuretech Components

Singapore . 39,000 parts In-Stock

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Lixinc

USA . 17,941 parts In-Stock

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iodParts Technologies Inc.

India . 12,840 parts In-Stock

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SupplyDigital Components

Austria . 5,681 parts In-Stock

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Kulean Microsystems

USA . 5,624 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Problanco Electronics

Mexico . 3,076 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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TANS Electronics

Latvia . 1,563 parts In-Stock

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GreenTree Electronics

Israel . 727 parts In-Stock

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UHIMA Technologies

Türkiye . 334 parts In-Stock

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334

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Speed Components Ltd (Excess)

Israel . 203 parts In-Stock

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Overview

Enhance your electronic projects with the NL27WZ16DFT2G by Onsemi, a top-tier manufacturer known for quality and reliability. As a leading player in the Logic Gates category, this product offers unparalleled performance and versatility. Whether you're designing cutting-edge technology or tinkering with DIY projects, the NL27WZ16DFT2G provides value, benefits, and advantages that cater to all your needs. Elevate your creations with this innovative solution from Onsemi and experience the difference in your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material helps protect the components inside the logic gate, ensuring reliability and longevity.

Surface Mount: YES

Surface mount capability allows for easy installation on printed circuit boards, saving space and making manufacturing more efficient.

Nominal Supply Voltage / Vsup (V): 2.3

Optimal supply voltage of 2.3V ensures efficient and reliable performance of the logic gate.

Propagation Delay (tpd): 10.2 ns

Fast propagation delay of 10.2 nanoseconds ensures quick response times and high-speed operation of the logic gate.

Maximum Operating Temperature: 125 °C

Wide operating temperature range of up to 125°C allows for use in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gate energy-efficient and reliable.

Technical Specifications

Logic Gates NL27WZ16DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay (tpd):

10.2 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NL27WZ16DFT2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-653-7278, 5962016537278

NIIN

016537278

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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