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NL27WZ04DFT2G

Onsemi

NL27WZ04DFT2G by Onsemi

NL27WZ04DFT2G by Onsemi is a Logic Gates IC with 5ns Propagation Delay, 11ns tpd, and 24A Max I (ol). Ideal for military applications due to its MILITARY Temperature Grade. Suitable for surface mount designs with PLASTIC/EPOXY package material.

Median Price

$0.032

Lifecycle Status

Suppliers In-Stock

33

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 28,934 parts In-Stock

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$0.100

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$0.038

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$0.030

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28,934

$0.100

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Mouser Electronics

USA . 6,281 parts In-Stock

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$0.110

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$0.040

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$0.032

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$0.029

6,281

$0.110

$0.040

$0.032

$0.029

Verical

USA . 30,000 parts In-Stock

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Master Electronics

USA . 30,000 parts In-Stock

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Chip1Stop

Japan . 24,000 parts In-Stock

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Future Electronics

Canada . 21,000 parts In-Stock

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Rochester

USA . 15,000 parts In-Stock

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$0.031

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$0.026

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EBV Elektronik

Germany . 6,000 parts In-Stock

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Arrow

USA . 3,000 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 329 parts In-Stock

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$0.024

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Nova Conductors

Japan . 42 parts In-Stock

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Component Electronics Inc.

Canada . 3,000 parts In-Stock

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$1.540

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Chip Stock

USA . 368,500 parts In-Stock

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Flip Electronics

USA . 99,000 parts In-Stock

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IBS Electronics

USA . 72,000 parts In-Stock

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NAC Semi

USA . 36,000 parts In-Stock

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Vyrian

USA . 15,782 parts In-Stock

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ComSIT Distribution GmbH

Germany . 14,995 parts In-Stock

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ComSIT USA

USA . 12,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 11,413 parts In-Stock

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Sensible Micro Corp

USA . 8,344 parts In-Stock

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Semi Source

USA . 5,818 parts In-Stock

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QIE Inc.

USA . 4,523 parts In-Stock

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Speed Components Ltd

Israel . 3,170 parts In-Stock

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Semtec, LLC

USA . 2,057 parts In-Stock

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NPI Materials, Inc.

USA . 1,655 parts In-Stock

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Component Sense

UK . 183 parts In-Stock

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Prism Electronics

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LIBRA Elektronik GmbH

Germany . 100 parts In-Stock

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North Shore Components

USA . 50 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

USA . 50 parts In-Stock

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J2 Sourcing AB

Sweden . 8 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 18,069 parts In-Stock

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$0.018

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$0.018

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$0.017

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18,069

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Ampacity Inc.

Singapore . 16,576 parts In-Stock

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Corphita

USA . 1,157 parts In-Stock

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Corohmni

South Africa . 341 parts In-Stock

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341

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Continental Prestige Electronics

USA . 6,187 parts In-Stock

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$0.090

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$0.089

6,187

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Argo Parts USA

USA . 3,999 parts In-Stock

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$0.088

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Vigor

Singapore . 598 parts In-Stock

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$0.390

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Aztec Data Supply Inc.

USA . 4,293 parts In-Stock

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$12.060

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Advanced Electronics

New Zealand . 48 parts In-Stock

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$16.162

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$15.354

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Perfect Parts

USA . 129,556 parts In-Stock

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iodParts Technologies Inc.

India . 17,999 parts In-Stock

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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SupplyDigital Components

Austria . 5,257 parts In-Stock

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TANS Electronics

Latvia . 5,131 parts In-Stock

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Problanco Electronics

Mexico . 3,257 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Authorized Procurement Solutions

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Speed Components Ltd (Excess)

Israel . 1,365 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Kulean Microsystems

USA . 984 parts In-Stock

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984

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Lixinc

USA . 517 parts In-Stock

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UHIMA Technologies

Türkiye . 162 parts In-Stock

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Microchip USA

USA . 139 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$0.089

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$0.086

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$0.084

100

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$0.089

$0.086

$0.084

Overview

Looking for high-quality logic gates to enhance your electronic projects? Look no further than the NL27WZ04DFT2G by Onsemi. With a reputable manufacturer like Onsemi, you can trust in the reliability and performance of this product. Ideal for a wide range of applications, this logic gate offers fast propagation delay, low power consumption, and compact packaging for easy integration. Upgrade your designs with the NL27WZ04DFT2G and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Propagation Delay At Nominal Supply: 5 ns

Fast response time, making the device efficient for time-critical operations.

Surface Mount: YES

Easy to integrate onto circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 2.3

Compatible with lower voltage systems, providing flexibility for different power requirements.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring reliability in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Logic Gates NL27WZ04DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

27WZ

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NL27WZ04DFT2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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