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NL27WZ04DTT1G

Onsemi

NL27WZ04DTT1G by Onsemi

NL27WZ04DTT1G by Onsemi is a CMOS Logic Gates with 2 functions, Vsup range of 1.65V to 5.5V, and tpd of 11ns. Ideal for military applications due to its MIL temperature grade, small form factor (3x1.5mm), and low power consumption at 3.3V supply voltage.

Median Price

$0.235

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 1 parts In-Stock

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$0.321

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1

$0.321

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Arrow

USA . 469 parts In-Stock

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469

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Verical

USA . 469 parts In-Stock

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$0.149

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469

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Distributors (In-Stock)

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Flip Electronics

USA . 3,000 parts In-Stock

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$0.060

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$0.060

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Nova Conductors

Japan . 1,000 parts In-Stock

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$0.132

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$0.132

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Digiode

USA . 543 parts In-Stock

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Chip Stock

USA . 42,430 parts In-Stock

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Vyrian

USA . 7,420 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

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Sunrise Surplus Inc.

USA . 2,995 parts In-Stock

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Rebound Electronics

UK . 2,517 parts In-Stock

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Prism Electronics

USA . 220 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 70 parts In-Stock

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Bristol Electronics

USA . 30 parts In-Stock

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$0.609

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Inventory MP

USA . 23 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 15 parts In-Stock

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Bas Electronics GmbH & Co. KG

Germany . 10 parts In-Stock

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Cyclops Electronics Ltd

UK . 5 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 313 parts In-Stock

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$0.127

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313

$0.127

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Semicontronic

India . 4 parts In-Stock

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$0.127

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$0.124

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$0.123

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4

$0.127

$0.124

$0.123

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Bastille Electronics

Australia . 3,894 parts In-Stock

1+ parts

$0.132

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$0.125

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$0.119

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$0.117

3,894

$0.132

$0.125

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$0.117

Argo Parts USA

USA . 1,396 parts In-Stock

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$0.132

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$0.129

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Corohmni

South Africa . 319 parts In-Stock

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$0.149

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Corphita

USA . 2,185 parts In-Stock

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$0.161

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Continental Prestige Electronics

USA . 7,505 parts In-Stock

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$0.282

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$0.108

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$0.082

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$0.282

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$0.082

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Vigor

Singapore . 638 parts In-Stock

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$0.370

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$0.370

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AZTECH Wire

Italy . 359 parts In-Stock

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$6.416

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Aztec Data Supply Inc.

USA . 1,735 parts In-Stock

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Perfect Parts

USA . 359,271 parts In-Stock

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GreenTree Electronics

Israel . 162,000 parts In-Stock

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Lixinc

USA . 12,176 parts In-Stock

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SupplyDigital Components

Austria . 8,329 parts In-Stock

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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Kulean Microsystems

USA . 3,587 parts In-Stock

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Problanco Electronics

Mexico . 3,499 parts In-Stock

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Kepictronics

USA . 2,500 parts In-Stock

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TANS Electronics

Latvia . 2,063 parts In-Stock

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UHIMA Technologies

Türkiye . 486 parts In-Stock

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Overview

Discover the power of innovation with the NL27WZ04DTT1G by Onsemi. Crafted with precision and quality, this logic gate offers exceptional performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this product provides unparalleled value, delivering efficiency and functionality like never before. Trust in Onsemi's expertise and elevate your projects with the NL27WZ04DTT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material for long-lasting use.

Surface Mount: YES

Easy to install on circuit boards.

No. of Functions: 2

Offers multiple functions in one component.

Package Shape: RECTANGULAR

Space-efficient design for compact circuits.

Nominal Supply Voltage/Vsup (V): 2.3

Low power consumption for energy efficiency.

Load Capacitance (CL): 50 pF

Ideal for handling various capacitance loads.

Power Supplies (V): 3.3

Compatible with common power sources.

No. of Terminals: 6

Provides multiple connection points for versatility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Perfect for compact designs with limited space.

Maximum I (ol): 24 Amp

High current capacity for robust performance.

Propagation Delay (tpd): 11 ns

Fast signal processing for efficient operation.

Maximum Operating Temperature: 125 °C

Suitable for operation in high-temperature environments.

Minimum Operating Temperature: -55 °C

Can withstand low-temperature conditions.

Terminal Finish: MATTE TIN

Corrosion-resistant finish for longevity.

Terminal Position: DUAL

Allows for flexibility in installation orientation.

Maximum Seated Height: 1.1 mm

Low profile for space-saving installations.

Width: 1.5 mm

Slim design for compact circuit layouts.

Minimum Supply Voltage (Vsup): 1.65 V

Can operate at low voltage levels.

Maximum Time At Peak Reflow Temperature (s): 30

Resistant to high-temperature soldering processes.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering.

Length: 3 mm

Compact size for efficient use of board space.

Temperature Grade: MILITARY

Meets rigorous military standards for reliability.

Technology: CMOS

Advanced technology for high-performance operation.

Terminal Form: GULL WING

Easy to solder onto circuit boards.

Packing Method: TR

Secure packaging for safe transportation.

Terminal Pitch: 0.95 mm

Uniform terminal spacing for precise connections.

Maximum Supply Voltage (Vsup): 5.5 V

Wide voltage range for flexibility in applications.

Technical Specifications

Logic Gates NL27WZ04DTT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

27WZ

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

NL27WZ04DTT1G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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