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NL27WZ17DFT2

Onsemi

NL27WZ17DFT2 by Onsemi

NL27WZ17DFT2 by Onsemi is a Logic Gate with 7.5ns Propagation Delay, 50pF Load Capacitance, and 1.8V Nominal Voltage. Ideal for military applications due to its Schmitt Trigger technology and -55°C to 125°C operating temperature range.

Median Price

$0.120

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 81,000 parts In-Stock

1+ parts

$0.120

100+ parts

$0.120

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$0.120

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81,000

$0.120

$0.120

$0.120

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Distributors (In-Stock)

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Digiode

USA . 2,235 parts In-Stock

1+ parts

$0.114

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-

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2,235

$0.114

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-

-

Chip Stock

USA . 407,500 parts In-Stock

1+ parts

-

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407,500

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Vyrian

USA . 80,500 parts In-Stock

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80,500

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Distributors (Availability)

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Ampacity Inc.

Singapore . 80,764 parts In-Stock

1+ parts

$0.102

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-

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80,764

$0.102

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-

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Corphita

USA . 304 parts In-Stock

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$0.108

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304

$0.108

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Corohmni

South Africa . 62 parts In-Stock

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$0.120

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62

$0.120

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Vigor

Singapore . 127 parts In-Stock

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$0.140

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127

$0.140

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Aztec Data Supply Inc.

USA . 972 parts In-Stock

1+ parts

$15.461

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972

$15.461

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Kulean Microsystems

USA . 8,160 parts In-Stock

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TANS Electronics

Latvia . 6,316 parts In-Stock

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Problanco Electronics

Mexico . 5,090 parts In-Stock

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Continental Prestige Electronics

USA . 1,837 parts In-Stock

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1,837

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Argo Parts USA

USA . 347 parts In-Stock

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347

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SupplyDigital Components

Austria . 296 parts In-Stock

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UHIMA Technologies

Türkiye . 157 parts In-Stock

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157

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Aranea Global

USA . 100 parts In-Stock

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100

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Authorized Procurement Solutions

USA . 40 parts In-Stock

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40

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Overview

Unlock a world of possibilities with the NL27WZ17DFT2 by Onsemi. Crafted with precision and expertise, this logic gate offers unparalleled performance and reliability in a compact package. Ideal for a wide range of applications, this product provides customers with superior speed and efficiency, making it a must-have for any project. Experience the quality and value that Onsemi brings to the table with the NL27WZ17DFT2 - a game-changer in the world of logic gates.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the logic gates, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 7.5 ns

With a low propagation delay, this product offers quick response times for processing signals, making it ideal for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a relatively low supply voltage of 1.8V makes this product energy-efficient and suitable for power-constrained environments.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without compromising performance, ensuring reliability in harsh conditions.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making it a desirable choice for efficient logic gate operation.

Technical Specifications

Logic Gates NL27WZ17DFT2 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

27WZ

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

15.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

NL27WZ17DFT2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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