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NL27WZ08USG-L22190

Onsemi

NL27WZ08USG-L22190 by Onsemi

NL27WZ08USG-L22190 by Onsemi is a Logic Gates IC with 2 functions and inputs. It operates at 2.3V, has 11ns propagation delay, and can handle up to 32A current. Ideal for applications requiring fast signal processing in temperature range of -55 to 125°C.

Median Price

$0.139

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 51,000 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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$0.139

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500

$0.139

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Chip Stock

USA . 95,500 parts In-Stock

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Vyrian

USA . 50,689 parts In-Stock

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Flip Electronics

USA . 2,536 parts In-Stock

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Digiode

USA . 1,555 parts In-Stock

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Semicontronic

India . 50,601 parts In-Stock

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$0.085

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$0.083

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$0.082

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50,601

$0.085

$0.083

$0.082

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Ampacity Inc.

Singapore . 50,588 parts In-Stock

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$0.085

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Corohmni

South Africa . 303 parts In-Stock

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$0.100

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Continental Prestige Electronics

USA . 6,055 parts In-Stock

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$0.136

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$0.134

6,055

$0.136

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$0.134

Argo Parts USA

USA . 3,444 parts In-Stock

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$0.136

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$0.132

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Netroflash

USA . 100 parts In-Stock

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$0.139

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$0.133

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$0.130

100

$0.139

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$0.130

Aztec Data Supply Inc.

USA . 4,658 parts In-Stock

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$20.490

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$21.074

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$20.020

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$20.020

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$21.074

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$20.020

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RC Electronics

USA . 60,000 parts In-Stock

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Futuretech Components

Singapore . 8,980 parts In-Stock

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Problanco Electronics

Mexico . 5,442 parts In-Stock

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Microchip USA

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Glotronic Ltd.

UK . 2,400 parts In-Stock

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TANS Electronics

Latvia . 1,996 parts In-Stock

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Corphita

USA . 1,705 parts In-Stock

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SupplyDigital Components

Austria . 1,201 parts In-Stock

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 988 parts In-Stock

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Overview

Discover the cutting-edge NL27WZ08USG-L22190 logic gates from Onsemi, designed to deliver top-quality performance for your electronic projects. With a focus on precision and reliability, these logic gates offer a wide range of applications in various industries. From consumer electronics to industrial automation, this product provides unmatched value and benefits to customers seeking efficient solutions for their circuit design needs. Upgrade your projects with the exceptional advantages of Onsemi's NL27WZ08USG-L22190 logic gates today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the logic gates, making it a reliable choice for long-term use.

Surface Mount: YES

This feature allows for easy and convenient installation on PCBs, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in a single component can help in reducing the overall component count in a circuit, leading to a more compact and efficient design.

No. of Inputs: 2

With a sufficient number of inputs, these logic gates can perform complex logical operations effectively, making them versatile for various applications.

Nominal Supply Voltage / Vsup (V): 2.3

The specified supply voltage ensures that the logic gates operate within their optimal voltage range, resulting in reliable and consistent performance.

Propagation Delay (tpd): 11 ns

The low propagation delay ensures high-speed operation of the logic gates, making them suitable for applications requiring quick response times.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows these logic gates to function reliably even in challenging environmental conditions, increasing their suitability for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making these logic gates energy efficient and reliable in noisy environments.

Technical Specifications

Logic Gates NL27WZ08USG-L22190 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay (tpd):

11 ns

Schmitt Trigger:

NO

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

NL27WZ08USG-L22190 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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