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NL17SV08XV5T2

Onsemi

NL17SV08XV5T2 by Onsemi

NL17SV08XV5T2 by Onsemi is a Logic Gate with 2 inputs, 14.6 ns propagation delay, and 3.3V nominal voltage. Ideal for industrial applications requiring fast signal processing in compact designs due to its small outline package style and low power consumption.

Median Price

$0.089

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,955 parts In-Stock

1+ parts

-

100+ parts

$0.092

1k+ parts

$0.077

10k+ parts

$0.068

6,955

-

$0.092

$0.077

$0.068

Verical

USA . 6,955 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.086

6,955

-

-

-

$0.086

Distributors (In-Stock)

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Digiode

USA . 2,475 parts In-Stock

1+ parts

$0.072

100+ parts

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2,475

$0.072

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Vyrian

USA . 7,560 parts In-Stock

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7,560

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Cyclops Electronics Ltd

UK . 5,969 parts In-Stock

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5,969

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Distributors (Availability)

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Corphita

USA . 1,105 parts In-Stock

1+ parts

$0.068

100+ parts

-

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1,105

$0.068

-

-

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Vigor

Singapore . 598 parts In-Stock

1+ parts

$0.070

100+ parts

-

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598

$0.070

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-

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Corohmni

South Africa . 152 parts In-Stock

1+ parts

$0.076

100+ parts

-

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152

$0.076

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AZTECH Wire

Italy . 48 parts In-Stock

1+ parts

$10.720

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48

$10.720

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Kulean Microsystems

USA . 7,283 parts In-Stock

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7,283

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Continental Prestige Electronics

USA . 6,955 parts In-Stock

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$0.066

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6,955

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-

$0.066

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TANS Electronics

Latvia . 6,012 parts In-Stock

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6,012

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Kepictronics

USA . 5,969 parts In-Stock

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5,969

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SupplyDigital Components

Austria . 5,019 parts In-Stock

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5,019

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RC Electronics

USA . 3,600 parts In-Stock

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3,600

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Problanco Electronics

Mexico . 2,344 parts In-Stock

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2,344

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A-Z Elektronik GmbH

Germany . 1,790 parts In-Stock

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1,790

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Microchip USA

USA . 418 parts In-Stock

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418

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UHIMA Technologies

Türkiye . 338 parts In-Stock

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338

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Overview

Discover the cutting-edge NL17SV08XV5T2 by Onsemi, offering unparalleled quality and reliability in the world of logic gates. Manufactured by industry leader Onsemi, this innovative product is perfect for a wide range of applications. With a small outline and very thin profile, it's designed for maximum performance while taking up minimal space. Experience lightning-fast propagation delays and exceptional load capacitance, all with a nominal supply voltage of 3.3V. Trust Onsemi to deliver top-notch products that exceed expectations. Unlock the potential of your projects with the NL17SV08XV5T2 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 14.6 ns

Low propagation delay ensures fast and efficient signal processing, making this logic gate suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage of 3.3V, making it compatible with a wide range of electronic devices and systems.

No. of Inputs: 2

Having two inputs allows for simple logic operations and versatile use in various digital circuits.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this logic gate is suitable for industrial applications that require reliable performance in harsh environments.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making this logic gate energy-efficient and reliable.

Technical Specifications

Logic Gates NL17SV08XV5T2 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

17SV

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Length:

1.6 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

2 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL6,.047,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

14.6 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.6 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.2 mm

Trade Compliance

NL17SV08XV5T2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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