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NBSG53AMNR2

Onsemi

NBSG53AMNR2 by Onsemi

NBSG53AMNR2 by Onsemi is a Clock Driver & Buffer with 0.275 ns Propagation Delay, 2.5V Nominal Voltage, and -40 to 85 °C Operating Temperature range. Ideal for applications requiring fast signal transmission in industrial settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,104 parts In-Stock

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Digiode

USA . 2,308 parts In-Stock

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2,308

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Distributors (Availability)

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AZTECH Wire

Italy . 527 parts In-Stock

1+ parts

$9.800

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527

$9.800

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Advanced Electronics

New Zealand . 800 parts In-Stock

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$29.307

100+ parts

$29.014

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$27.842

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800

$29.307

$29.014

$27.842

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Ampacity Inc.

Singapore . 814 parts In-Stock

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$35.000

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814

$35.000

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QUARKTWIN TECHNOLOGY LTD

USA . 17,743 parts In-Stock

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TANS Electronics

Latvia . 7,003 parts In-Stock

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7,003

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Problanco Electronics

Mexico . 6,487 parts In-Stock

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Corphita

USA . 2,220 parts In-Stock

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Kulean Microsystems

USA . 2,059 parts In-Stock

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SupplyDigital Components

Austria . 1,018 parts In-Stock

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Microchip USA

USA . 266 parts In-Stock

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Corohmni

South Africa . 158 parts In-Stock

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UHIMA Technologies

Türkiye . 37 parts In-Stock

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Overview

Enhance your electronic designs with the high-quality NBSG53AMNR2 clock driver by Onsemi. As a leading manufacturer in the industry, Onsemi delivers reliable and efficient products that meet the demands of various applications. The NBSG53AMNR2 offers unparalleled value with its fast propagation delay, differential input conditioning, and wide range of power supplies. Whether you're working on telecommunications, networking, or industrial automation projects, this clock driver will provide the performance and precision you need to bring your designs to life. Choose Onsemi for innovative solutions that elevate your designs to the next level.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.275 ns

Low propagation delay ensures precise timing and synchronization in clock applications.

Surface Mount: YES

Surface mount packaging allows for easy and compact installation on circuit boards.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity.

Package Shape: SQUARE

Square package shape offers efficient use of space and simplifies layout design.

Nominal Supply Voltage / Vsup (V): 2.5

Compatible with standard 2.5V supply voltage, making it suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Technical Specifications

Clock Drivers & Buffers NBSG53AMNR2 attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

53

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay At Nominal Supply:

.275 ns

Propagation Delay (tpd):

.285 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

NBSG53AMNR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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