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NBSG16VSBAHTBG

Onsemi

NBSG16VSBAHTBG by Onsemi

NBSG16VSBAHTBG by Onsemi is a Line Transceiver with 16 terminals and a low profile grid array package. It operates at industrial temperature grade, with max supply voltage of 3.465 V and differential output capability. Ideal for applications requiring fast signal transmission in compact spaces.

Median Price

$31.522

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,900 parts In-Stock

1+ parts

-

100+ parts

$28.020

1k+ parts

$25.070

10k+ parts

$23.590

7,900

-

$28.020

$25.070

$23.590

Verical

USA . 7,900 parts In-Stock

1+ parts

-

100+ parts

$35.025

1k+ parts

$31.337

10k+ parts

$29.488

7,900

-

$35.025

$31.337

$29.488

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,253 parts In-Stock

1+ parts

$29.650

100+ parts

-

1k+ parts

-

10k+ parts

-

2,253

$29.650

-

-

-

Vyrian

USA . 6,490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,490

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 94 parts In-Stock

1+ parts

$8.540

100+ parts

-

1k+ parts

-

10k+ parts

-

94

$8.540

-

-

-

Corohmni

South Africa . 117 parts In-Stock

1+ parts

$26.430

100+ parts

-

1k+ parts

-

10k+ parts

-

117

$26.430

-

-

-

Corphita

USA . 1,224 parts In-Stock

1+ parts

$28.089

100+ parts

-

1k+ parts

-

10k+ parts

-

1,224

$28.089

-

-

-

Continental Prestige Electronics

USA . 7,900 parts In-Stock

1+ parts

-

100+ parts

$25.480

1k+ parts

-

10k+ parts

-

7,900

-

$25.480

-

-

Kulean Microsystems

USA . 7,440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,440

-

-

-

-

SupplyDigital Components

Austria . 7,257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,257

-

-

-

-

Problanco Electronics

Mexico . 6,102 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,102

-

-

-

-

TANS Electronics

Latvia . 2,249 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,249

-

-

-

-

UHIMA Technologies

Türkiye . 610 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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610

-

-

-

-

Microchip USA

USA . 330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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330

-

-

-

-

Overview

Elevate your electronic designs with the NBSG16VSBAHTBG Line Driver & Receiver by Onsemi. Crafted with precision and quality, this cutting-edge component offers unmatched performance and reliability for a wide range of applications. From industrial automation to telecommunications, this versatile product delivers seamless connectivity and enhanced efficiency. Trust in Onsemi's expertise and experience to bring you a superior solution that adds value to your projects. Experience the difference with the NBSG16VSBAHTBG - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy and efficient installation on a circuit board.

Maximum Supply Voltage: 3.465 V

Supports a wide range of voltage inputs for flexibility in different applications.

Maximum Transmit Delay: 0.145 ns

Ensures fast data transmission with minimal delay.

Power Supplies (V): +-2.5/+-3.3

Versatile power supply options for compatibility with different systems.

Maximum Operating Temperature: 85 °C

Suitable for use in industrial environments with varying temperature conditions.

Differential Output: YES

Provides improved noise immunity and signal integrity in high-speed data applications.

Terminal Pitch: 1 mm

Allows for compact design and efficient use of space on a circuit board.

Interface IC Type: LINE TRANSCEIVER

Specifically designed for transmitting and receiving data signals, ensuring reliable communication.

Technical Specifications

Line Drivers & Receivers NBSG16VSBAHTBG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PBGA-B16

Length:

4 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA16,4X4,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Power Supplies (V):

+-2.5/+-3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.145 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.4 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

34 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Transmit Delay:

.145 ns

Width:

4 mm

Trade Compliance

NBSG16VSBAHTBG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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