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NB7L585RMNG

Onsemi

NB7L585RMNG by Onsemi

NB7L585RMNG clock driver by Onsemi features a propagation delay of 0.3ns, differential mux input conditioning, and 6 true outputs with a min fmax of 6000MHz. Ideal for applications requiring precise clock signal distribution in industrial settings due to its low delay and high-speed capabilities.

Median Price

$7.787

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 173 parts In-Stock

1+ parts

-

100+ parts

$6.230

1k+ parts

$5.580

10k+ parts

$5.250

173

-

$6.230

$5.580

$5.250

DigiKey

USA . 173 parts In-Stock

1+ parts

-

100+ parts

$8.200

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-

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173

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$8.200

-

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Verical

USA . 161 parts In-Stock

1+ parts

-

100+ parts

$7.787

1k+ parts

$6.975

10k+ parts

$6.563

161

-

$7.787

$6.975

$6.563

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 747 parts In-Stock

1+ parts

$6.593

100+ parts

-

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747

$6.593

-

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Vyrian

USA . 7,542 parts In-Stock

1+ parts

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7,542

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Distributors (Availability)

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Corphita

USA . 541 parts In-Stock

1+ parts

$6.246

100+ parts

-

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541

$6.246

-

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Corohmni

South Africa . 63 parts In-Stock

1+ parts

$6.940

100+ parts

-

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63

$6.940

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-

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Component Stockers USA

USA . 134 parts In-Stock

1+ parts

$7.020

100+ parts

$6.600

1k+ parts

-

10k+ parts

-

134

$7.020

$6.600

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Microchip USA

USA . 2,252 parts In-Stock

1+ parts

$29.400

100+ parts

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2,252

$29.400

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Kulean Microsystems

USA . 3,128 parts In-Stock

1+ parts

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3,128

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Problanco Electronics

Mexico . 881 parts In-Stock

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881

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SupplyDigital Components

Austria . 402 parts In-Stock

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402

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TANS Electronics

Latvia . 221 parts In-Stock

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Continental Prestige Electronics

USA . 173 parts In-Stock

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UHIMA Technologies

Türkiye . 91 parts In-Stock

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91

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Overview

Discover the NB7L585RMNG Clock Drivers & Buffers by Onsemi, a top-tier manufacturer known for delivering high-quality components. This versatile product is perfect for applications requiring precise timing and synchronization. With a propagation delay of only 0.3 ns and differential mux input conditioning, this chip carrier offers unmatched performance and reliability. Experience the benefits of ultra-fast signal processing and minimal skew, making it ideal for industrial-grade projects. Upgrade your systems with the NB7L585RMNG and unlock a world of possibilities.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.3 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount packaging allows for easy integration onto PCBs, saving space and reducing assembly time.

Input Conditioning: DIFFERENTIAL MUX

Differential MUX input conditioning helps in reducing noise and improving signal integrity, making this product reliable in noisy environments.

Nominal Supply Voltage / Vsup (V): 2.5

Standard supply voltage compatibility ensures easy integration with existing systems and components.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows this product to be used in extreme temperature conditions, enhancing its versatility.

Technical Specifications

Clock Drivers & Buffers NB7L585RMNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 3.3 V

Family:

7L

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.3 ns

Propagation Delay (tpd):

.225 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

6000 MHz

Trade Compliance

NB7L585RMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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