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NB7L11MMN

Onsemi

NB7L11MMN by Onsemi

NB7L11MMN clock driver by Onsemi features a propagation delay of 0.15 ns, operates at a nominal voltage of 2.5V, and has a max operating temperature of 85 °C. Ideal for applications requiring high-speed signal transmission in industrial settings with differential input conditioning needs.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 5,757 parts In-Stock

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Digiode

USA . 914 parts In-Stock

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AZTECH Wire

Italy . 242 parts In-Stock

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$10.450

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$39.971

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$36.374

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$32.776

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Component Stockers USA

USA . 339 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 6,578 parts In-Stock

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SupplyDigital Components

Austria . 6,389 parts In-Stock

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Problanco Electronics

Mexico . 5,895 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,322 parts In-Stock

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Kulean Microsystems

USA . 5,141 parts In-Stock

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Corphita

USA . 2,377 parts In-Stock

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UHIMA Technologies

Türkiye . 715 parts In-Stock

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Corohmni

South Africa . 390 parts In-Stock

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Microchip USA

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Overview

Unlock the power of precision timing with the NB7L11MMN clock driver and buffer from Onsemi. Designed to deliver unparalleled performance and reliability, this innovative product is perfect for a wide range of applications in the clock drivers & buffers category. With a nominal supply voltage of 2.5V and a propagation delay of just 0.15ns, the NB7L11MMN offers customers unmatched speed and accuracy. Say goodbye to delays and inefficiencies - choose Onsemi for cutting-edge technology that meets your needs.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.15 ns

Low propagation delay ensures fast signal transmission, making this clock driver suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto PCBs, saving space and simplifying assembly.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity, essential for critical timing applications.

Nominal Supply Voltage: 2.5V

Operates at a common supply voltage, making it compatible with various systems and reducing the need for additional voltage regulation.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in varying environmental conditions, suitable for industrial applications.

Technical Specifications

Clock Drivers & Buffers NB7L11MMN attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

7L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.15 ns

Propagation Delay (tpd):

.15 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Minimum fmax:

8000 MHz

Trade Compliance

NB7L11MMN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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