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NB7L14MN1TXG

Onsemi

NB7L14MN1TXG by Onsemi

NB7L14MN1TXG clock driver by Onsemi features a low propagation delay of 0.2 ns at 2.5V, with differential input conditioning and 4 true outputs. Ideal for industrial applications, this chip carrier package has a very thin profile and operates b/w -40 to 85 °C temperature range.

Median Price

$6.312

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$5.610

1k+ parts

$5.020

10k+ parts

$4.720

9,000

-

$5.610

$5.020

$4.720

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$7.013

1k+ parts

$6.275

10k+ parts

-

9,000

-

$7.013

$6.275

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,264 parts In-Stock

1+ parts

$5.938

100+ parts

-

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2,264

$5.938

-

-

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Vyrian

USA . 2,071 parts In-Stock

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-

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2,071

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,290 parts In-Stock

1+ parts

$5.625

100+ parts

-

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1,290

$5.625

-

-

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Corohmni

South Africa . 396 parts In-Stock

1+ parts

$6.250

100+ parts

-

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396

$6.250

-

-

-

Component Stockers USA

USA . 12,652 parts In-Stock

1+ parts

$6.470

100+ parts

$6.080

1k+ parts

$5.500

10k+ parts

-

12,652

$6.470

$6.080

$5.500

-

Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$9.977

100+ parts

$9.079

1k+ parts

$8.181

10k+ parts

-

150

$9.977

$9.079

$8.181

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AZTECH Wire

Italy . 1,219 parts In-Stock

1+ parts

$19.720

100+ parts

-

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1,219

$19.720

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Perfect Parts

USA . 14,545 parts In-Stock

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14,545

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Kulean Microsystems

USA . 8,354 parts In-Stock

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8,354

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Problanco Electronics

Mexico . 4,373 parts In-Stock

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4,373

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SupplyDigital Components

Austria . 4,144 parts In-Stock

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TANS Electronics

Latvia . 2,653 parts In-Stock

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2,653

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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2,500

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UHIMA Technologies

Türkiye . 757 parts In-Stock

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757

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Futuretech Components

Singapore . 707 parts In-Stock

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707

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Microchip USA

USA . 492 parts In-Stock

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492

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Overview

Unlock unparalleled precision and reliability with the NB7L14MN1TXG clock driver and buffer by Onsemi. Crafted with cutting-edge technology and expertise, this product is designed to deliver seamless performance in a wide range of applications. From enhancing data transmission speeds to optimizing system efficiency, this innovative solution offers unmatched value to customers seeking top-tier quality and superior functionality. Experience the difference with Onsemi's NB7L14MN1TXG - the ultimate choice for your clock driver and buffering needs.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.2 ns

Low propagation delay ensures accurate timing information, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount design allows for easy installation and space-saving on PCBs, making it convenient for compact designs.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity, making this product reliable for data communication systems.

Nominal Supply Voltage: 2.5V

Operating at a standard voltage of 2.5V ensures compatibility with a wide range of systems and power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even in harsh environmental conditions, making it suitable for industrial applications.

Technical Specifications

Clock Drivers & Buffers NB7L14MN1TXG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

7L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.2 ns

Propagation Delay (tpd):

.2 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB7L14MN1TXG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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