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NB7L1008MNG

Onsemi

NB7L1008MNG by Onsemi

NB7L1008MNG by Onsemi is a clock driver with 0.22 ns propagation delay at 2.5V, suitable for industrial applications. It features 16 true outputs, differential input conditioning, and operates within -40 to 85°C temperature range. Ideal for high-speed signal transmission in electronic systems.

Median Price

$6.334

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3 parts In-Stock

1+ parts

$5.850

100+ parts

-

1k+ parts

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3

$5.850

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Chip1Stop

Japan . 3 parts In-Stock

1+ parts

$6.380

100+ parts

-

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3

$6.380

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Mouser Electronics

USA . 63 parts In-Stock

1+ parts

$11.210

100+ parts

$7.000

1k+ parts

$6.610

10k+ parts

$6.490

63

$11.210

$7.000

$6.610

$6.490

DigiKey

USA . 13 parts In-Stock

1+ parts

$11.210

100+ parts

$7.625

1k+ parts

$6.982

10k+ parts

$6.826

13

$11.210

$7.625

$6.982

$6.826

Verical

USA . 27,824 parts In-Stock

1+ parts

-

100+ parts

$6.289

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27,824

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$6.289

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Rochester

USA . 2,970 parts In-Stock

1+ parts

-

100+ parts

$6.250

1k+ parts

$5.590

10k+ parts

$5.260

2,970

-

$6.250

$5.590

$5.260

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,023 parts In-Stock

1+ parts

$5.558

100+ parts

-

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2,023

$5.558

-

-

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Flip Electronics

USA . 27,824 parts In-Stock

1+ parts

-

100+ parts

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27,824

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Vyrian

USA . 2,018 parts In-Stock

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2,018

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 865 parts In-Stock

1+ parts

$5.265

100+ parts

-

1k+ parts

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10k+ parts

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865

$5.265

-

-

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Corohmni

South Africa . 142 parts In-Stock

1+ parts

$5.850

100+ parts

-

1k+ parts

-

10k+ parts

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142

$5.850

-

-

-

Microchip USA

USA . 1,563 parts In-Stock

1+ parts

$31.160

100+ parts

$30.720

1k+ parts

$30.500

10k+ parts

$30.270

1,563

$31.160

$30.720

$30.500

$30.270

QUARKTWIN TECHNOLOGY LTD

USA . 26,787 parts In-Stock

1+ parts

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26,787

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Kulean Microsystems

USA . 8,359 parts In-Stock

1+ parts

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8,359

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Problanco Electronics

Mexico . 2,556 parts In-Stock

1+ parts

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2,556

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TANS Electronics

Latvia . 1,257 parts In-Stock

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1,257

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SupplyDigital Components

Austria . 1,136 parts In-Stock

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1,136

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UHIMA Technologies

Türkiye . 757 parts In-Stock

1+ parts

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757

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Overview

Enhance the performance of your clock drivers with the NB7L1008MNG by Onsemi. With a focus on quality and reliability, Onsemi is a leading manufacturer in the industry. Clock Drivers & Buffers like this one are essential for ensuring precise timing in electronic systems. The NB7L1008MNG offers value through its low propagation delay and differential input conditioning, making it ideal for a wide range of applications. Trust in Onsemi to deliver high-quality products that meet your needs and exceed your expectations.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.22 ns

Low propagation delay ensures fast and efficient operation of the clock driver.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Input Conditioning: DIFFERENTIAL

Differential input conditioning provides better noise immunity and signal integrity.

Nominal Supply Voltage / Vsup (V): 2.5

Optimal supply voltage for reliable performance of the clock driver.

Package Shape: SQUARE

Square package shape helps in efficient utilization of space on the PCB.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes this clock driver suitable for industrial applications.

Technical Specifications

Clock Drivers & Buffers NB7L1008MNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

NB7

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.22 ns

Propagation Delay (tpd):

.22 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

NB7L1008MNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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