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NB7L111MMNR2G

Onsemi

NB7L111MMNR2G by Onsemi

NB7L111MMNR2G by Onsemi is a clock driver with 0.28 ns propagation delay at 2.5V, suitable for industrial applications. It features differential mux input conditioning and 10 true outputs, making it ideal for high-speed signal transmission in electronic systems. The chip carrier package style with a very thin profile and quad terminal position ensures efficient integration into compact designs.

Median Price

$50.532

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 25 parts In-Stock

1+ parts

-

100+ parts

$43.640

1k+ parts

$39.050

10k+ parts

$36.750

25

-

$43.640

$39.050

$36.750

DigiKey

USA . 25 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25

-

-

-

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Verical

USA . 25 parts In-Stock

1+ parts

-

100+ parts

$57.425

1k+ parts

-

10k+ parts

-

25

-

$57.425

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,020 parts In-Stock

1+ parts

$46.180

100+ parts

-

1k+ parts

-

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1,020

$46.180

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-

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Vyrian

USA . 2,645 parts In-Stock

1+ parts

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-

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2,645

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,284 parts In-Stock

1+ parts

$43.749

100+ parts

-

1k+ parts

-

10k+ parts

-

1,284

$43.749

-

-

-

Corohmni

South Africa . 347 parts In-Stock

1+ parts

$48.610

100+ parts

-

1k+ parts

-

10k+ parts

-

347

$48.610

-

-

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Microchip USA

USA . 3,797 parts In-Stock

1+ parts

$99.015

100+ parts

-

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3,797

$99.015

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Kulean Microsystems

USA . 8,204 parts In-Stock

1+ parts

-

100+ parts

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8,204

-

-

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TANS Electronics

Latvia . 8,041 parts In-Stock

1+ parts

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8,041

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SupplyDigital Components

Austria . 7,902 parts In-Stock

1+ parts

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7,902

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Problanco Electronics

Mexico . 1,856 parts In-Stock

1+ parts

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1,856

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UHIMA Technologies

Türkiye . 689 parts In-Stock

1+ parts

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100+ parts

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689

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Overview

Enhance your electronic designs with the NB7L111MMNR2G Clock Driver & Buffer by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers cutting-edge solutions for a wide range of applications. This clock driver offers lightning-fast propagation delay, ensuring precise timing in your projects. With its surface mount capability and differential MUX input conditioning, this product is a versatile choice for any electronics enthusiast. Trust Onsemi to provide you with the highest value, benefits, and advantages in the industry. Elevate your designs with the NB7L111MMNR2G today!

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.28 ns

This ultra-low propagation delay ensures precise and efficient clock distribution within the system.

Surface Mount: YES

Surface mount capability makes installation and integration of the clock driver easier and more convenient.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, making it suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard supply voltage of 2.5V, making it compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures reliability under varying environmental conditions.

Terminal Finish: TIN

Tinned terminal finish provides excellent conductivity and solderability, ensuring a reliable connection.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stable performance in harsh industrial environments.

Maximum Supply Voltage (Vsup): 2.625 V

With a maximum supply voltage of 2.625V, it provides a safe operating range for the device, preventing damage.

Technical Specifications

Clock Drivers & Buffers NB7L111MMNR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES WITH 3.3V SUPPLY

Family:

7L

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N52

JESD-609 Code:

e3

Length:

8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC52,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.28 ns

Propagation Delay (tpd):

.28 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

NB7L111MMNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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