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NB7L1008MMNTWG

Onsemi

NB7L1008MMNTWG by Onsemi

NB7L1008MMNTWG clock driver by Onsemi features a low propagation delay of 0.25 ns, operates on power supplies of 2.5/3.3 V, and has a wide temperature range from -40 to 85 °C. This chip carrier package with 32 terminals is ideal for industrial applications requiring precise clock signal distribution in electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,268 parts In-Stock

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Digiode

USA . 1,936 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$19.199

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$17.471

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$15.743

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AZTECH Wire

Italy . 1,034 parts In-Stock

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$22.220

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Component Stockers USA

USA . 705 parts In-Stock

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$99.990

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705

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Problanco Electronics

Mexico . 7,551 parts In-Stock

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Kulean Microsystems

USA . 7,408 parts In-Stock

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SupplyDigital Components

Austria . 6,491 parts In-Stock

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TANS Electronics

Latvia . 4,643 parts In-Stock

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Corphita

USA . 2,043 parts In-Stock

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UHIMA Technologies

Türkiye . 783 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 244 parts In-Stock

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Overview

Looking for a reliable clock driver and buffer solution? Look no further than the NB7L1008MMNTWG by Onsemi. With top-notch quality and precision engineering from a trusted manufacturer like Onsemi, this product offers unparalleled performance and reliability in various applications. From telecommunications to networking, this clock driver and buffer will ensure smooth and efficient operation of your devices. Experience the value and benefits of using this high-quality product for your next project. Trust Onsemi for all your clock driver and buffer needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ensuring the product's longevity and resilience to physical damage.

Propagation Delay At Nominal Supply: 0.25 ns

With a very low propagation delay, this clock driver & buffer ensures high-speed and efficient performance in signal transmission within the circuit.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving time and effort during the assembly process.

Power Supplies (V): 2.5/3.3

Supporting multiple power supply voltages (2.5V and 3.3V) provides compatibility with a variety of systems and flexibility in setup options.

No. of Terminals: 32

Having a higher number of terminals allows for more connections and integration with other components, enabling complex circuit designs and functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers compactness and efficient heat dissipation, making it suitable for applications where space and thermal management are critical.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance in a wide range of environmental conditions, making it ideal for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows for operation in cold environments without compromising functionality, enhancing the product's versatility.

Terminal Finish: TIN

The tin terminal finish provides good conductivity and corrosion resistance, ensuring reliable electrical connections and long-term performance of the product.

Terminal Position: QUAD

The quad terminal position facilitates easy and secure connections with other components, simplifying installation and improving overall system reliability.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260 °C, the product can withstand the soldering process during assembly without damage, ensuring a robust construction.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature range means the product can operate reliably in harsh conditions commonly found in industrial environments, making it suitable for rugged applications.

Terminal Form: NO LEAD

The no-lead terminal form complies with environmental regulations and enhances solder joint reliability, ensuring compliance with industry standards and long-term performance.

Terminal Pitch: 0.5 mm

With a small terminal pitch of 0.5 mm, the product allows for high-density mounting on PCBs, saving valuable board space and enabling compact designs.

Technical Specifications

Clock Drivers & Buffers NB7L1008MMNTWG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.25 ns

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NB7L1008MMNTWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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