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NB7L11MMNR2

Onsemi

NB7L11MMNR2 by Onsemi

NB7L11MMNR2 by Onsemi is a clock driver with 0.15 ns propagation delay at 2.5V, suitable for industrial applications. It features differential input conditioning, 16 terminals, and operates b/w -40 to 85 °C. This chip carrier package has a very thin profile and supports peak reflow temperature of 235 °C.

Median Price

$25.064

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

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$25.064

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Vyrian

USA . 7,624 parts In-Stock

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Digiode

USA . 1,563 parts In-Stock

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AZTECH Wire

Italy . 522 parts In-Stock

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$17.830

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Component Stockers USA

USA . 584 parts In-Stock

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$99.990

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Problanco Electronics

Mexico . 8,015 parts In-Stock

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Kulean Microsystems

USA . 2,199 parts In-Stock

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SupplyDigital Components

Austria . 1,713 parts In-Stock

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Corphita

USA . 614 parts In-Stock

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TANS Electronics

Latvia . 500 parts In-Stock

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Corohmni

South Africa . 481 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 441 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the NB7L11MMNR2 clock driver & buffer from Onsemi. As a trusted manufacturer in the industry, Onsemi delivers cutting-edge technology that exceeds expectations. This versatile component is perfect for a variety of applications, offering ultra-fast propagation delay and differential input conditioning for superior signal quality. With its compact size and wide operating temperature range, the NB7L11MMNR2 provides exceptional value and flexibility for all your clocking needs. Take your designs to the next level with Onsemi's innovative solutions.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.15 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount package allows for easy and convenient installation on PCBs, saving space and simplifying assembly.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity, making this product reliable in noisy environments.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and uniform soldering, enhancing the overall reliability of the product.

Nominal Supply Voltage: 2.5V

Stable supply voltage of 2.5V ensures consistent performance and reliability of the product.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows this product to function reliably in extreme environmental conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and robust connections, ensuring long-term reliability of the product.

Minimum Supply Voltage (Vsup): 2.375V

Low minimum supply voltage enables this product to operate efficiently in low power applications, saving energy.

Maximum Supply Voltage (Vsup): 3.465V

High maximum supply voltage tolerance makes this product versatile and suitable for a wide range of applications.

Technical Specifications

Clock Drivers & Buffers NB7L11MMNR2 attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

7L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.15 ns

Propagation Delay (tpd):

.15 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Minimum fmax:

8000 MHz

Trade Compliance

NB7L11MMNR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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