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NB7L14MMN

Onsemi

NB7L14MMN by Onsemi

NB7L14MMN clock driver by Onsemi features a low propagation delay of 0.15 ns at 2.5V, suitable for industrial applications. With differential input conditioning and 4 true outputs, it operates in a temperature range of -40 to 85 °C. This surface-mount chip carrier package has a compact size of 3x3 mm with a terminal pitch of 0.5 mm.

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Vyrian

USA . 7,411 parts In-Stock

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AZTECH Wire

Italy . 153 parts In-Stock

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$16.180

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Component Stockers USA

USA . 515 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 29,882 parts In-Stock

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Metaverse IC Inc.

Canada . 9,540 parts In-Stock

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SupplyDigital Components

Austria . 6,652 parts In-Stock

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Kulean Microsystems

USA . 4,995 parts In-Stock

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Problanco Electronics

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A-Z Elektronik GmbH

Germany . 2,862 parts In-Stock

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Corphita

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UHIMA Technologies

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Microchip USA

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Overview

Enhance your electronic designs with the NB7L14MMN clock driver from Onsemi. As a leader in the industry, Onsemi ensures top-notch quality and reliability in all their products. Clock drivers & buffers like the NB7L14MMN are essential components for precision timing applications, offering fast propagation delay and differential input conditioning. With a nominal supply voltage of 2.5V, this chip carrier package is perfect for industrial settings. Experience seamless performance and efficiency with the NB7L14MMN - unlock the full potential of your electronics today!

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.15 ns

Low propagation delay ensures accurate synchronization in clock signal distribution.

Surface Mount: YES

Easy to mount on PCB for compact design and efficient use of space.

Input Conditioning: DIFFERENTIAL

Enhanced noise immunity and signal integrity in differential signal processing.

Nominal Supply Voltage / Vsup (V): 2.5

Suitable for standard power supply operation and compatibility.

Power Supplies (V): 2.5/3.3

Versatile power supply options for flexibility in different system configurations.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature range for robust performance.

Technical Specifications

Clock Drivers & Buffers NB7L14MMN attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

7L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.15 ns

Propagation Delay (tpd):

.15 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Minimum fmax:

8000 MHz

Trade Compliance

NB7L14MMN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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