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NB7L14MMNR2G

Onsemi

NB7L14MMNR2G by Onsemi

NB7L14MMNR2G clock driver by Onsemi has a low propagation delay of 0.15 ns at 2.5V, suitable for industrial applications. It features differential input conditioning, 4 true outputs, and operates in a temperature range of -40 to 85 °C. Ideal for high-speed systems requiring precise clock synchronization.

Median Price

$47.138

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,952 parts In-Stock

1+ parts

-

100+ parts

$41.900

1k+ parts

$37.490

10k+ parts

$35.290

4,952

-

$41.900

$37.490

$35.290

DigiKey

USA . 4,952 parts In-Stock

1+ parts

-

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4,952

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Verical

USA . 3,000 parts In-Stock

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-

100+ parts

$52.375

1k+ parts

$46.862

10k+ parts

-

3,000

-

$52.375

$46.862

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 724 parts In-Stock

1+ parts

$39.200

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-

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724

$39.200

-

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Digiode

USA . 1,985 parts In-Stock

1+ parts

$44.336

100+ parts

-

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1,985

$44.336

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 207 parts In-Stock

1+ parts

$39.200

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-

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207

$39.200

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Corphita

USA . 106 parts In-Stock

1+ parts

$42.003

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106

$42.003

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Microchip USA

USA . 5,965 parts In-Stock

1+ parts

$95.054

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5,965

$95.054

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Problanco Electronics

Mexico . 3,851 parts In-Stock

1+ parts

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3,851

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Kulean Microsystems

USA . 3,744 parts In-Stock

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3,744

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SupplyDigital Components

Austria . 2,857 parts In-Stock

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2,857

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TANS Electronics

Latvia . 1,783 parts In-Stock

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1,783

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UHIMA Technologies

Türkiye . 799 parts In-Stock

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799

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Overview

Unlock the power of precision with the NB7L14MMNR2G by Onsemi, a top-tier manufacturer renowned for high-quality clock drivers & buffers. Ideal for applications requiring speedy data transfer, this chip carrier features a very thin profile and differential input conditioning for optimal performance. With a propagation delay of just 0.15 ns, this industrial-grade device ensures minimal skew and maximum reliability. Elevate your projects with the unbeatable value, benefits, and advantages that only Onsemi can deliver.

Feature Benefit Bullets

Propagation Delay at Nominal Supply: 0.15 ns

Low propagation delay ensures accurate timing in clock signal distribution.

Surface Mount: YES

Ease of installation and space-saving design for compact electronic devices.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in noise immunity and signal integrity.

Package Shape: SQUARE

Square package shape allows for efficient layout and easy integration on circuit boards.

Nominal Supply Voltage: 2.5V

Stable supply voltage of 2.5V for reliable operation.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh environmental conditions.

Minimum fmax: 8000 MHz

High maximum frequency capability of 8000 MHz for fast clock signal processing.

No. of True Outputs: 4

Multiple true outputs for expanding clock signal distribution.

Technical Specifications

Clock Drivers & Buffers NB7L14MMNR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

7L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.15 ns

Propagation Delay (tpd):

.15 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Minimum fmax:

8000 MHz

Trade Compliance

NB7L14MMNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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