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NB7L1008MMNR4G

Onsemi

NB7L1008MMNR4G by Onsemi

NB7L1008MMNR4G clock driver by Onsemi features 32 terminals, 0.25 ns propagation delay, and 2.5/3.3V power supplies. Ideal for industrial applications requiring precise timing synchronization in a compact chip carrier package with standard input conditioning.

Median Price

$9.120

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,268 parts In-Stock

1+ parts

-

100+ parts

$8.840

1k+ parts

$7.910

10k+ parts

$7.450

1,268

-

$8.840

$7.910

$7.450

Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$9.393

10k+ parts

$9.393

1,000

-

-

$9.393

$9.393

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$9.393

10k+ parts

$9.393

1,000

-

-

$9.393

$9.393

Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.848

10k+ parts

-

1,000

-

-

$8.848

-

Distributors (In-Stock)

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Digiode

USA . 941 parts In-Stock

1+ parts

$9.358

100+ parts

-

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941

$9.358

-

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Vyrian

USA . 5,158 parts In-Stock

1+ parts

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5,158

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Flip Electronics

USA . 1,000 parts In-Stock

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1,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 538 parts In-Stock

1+ parts

$7.520

100+ parts

-

1k+ parts

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10k+ parts

-

538

$7.520

-

-

-

Corohmni

South Africa . 413 parts In-Stock

1+ parts

$8.848

100+ parts

-

1k+ parts

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-

413

$8.848

-

-

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Corphita

USA . 1,845 parts In-Stock

1+ parts

$8.865

100+ parts

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1,845

$8.865

-

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Microchip USA

USA . 4,848 parts In-Stock

1+ parts

$44.212

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4,848

$44.212

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Perfect Parts

USA . 7,356 parts In-Stock

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7,356

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A-Z Elektronik GmbH

Germany . 6,962 parts In-Stock

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6,962

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Kulean Microsystems

USA . 5,776 parts In-Stock

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Problanco Electronics

Mexico . 4,082 parts In-Stock

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SupplyDigital Components

Austria . 2,938 parts In-Stock

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2,938

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TANS Electronics

Latvia . 2,712 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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UHIMA Technologies

Türkiye . 600 parts In-Stock

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600

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Kepictronics

USA . 353 parts In-Stock

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353

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Enhance your design projects with the NB7L1008MMNR4G clock driver by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. This clock driver is perfect for applications requiring precise timing synchronization, making it ideal for a wide range of electronic devices. With its superior performance and efficiency, the NB7L1008MMNR4G offers exceptional value to customers, providing seamless integration and optimal functionality. Elevate your projects with this high-quality clock driver and experience the difference Onsemi brings to the table.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging makes it easy to integrate this clock driver and buffer into compact electronic designs.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal supply voltage of 2.5V ensures efficient power usage and compatibility with a wide range of systems.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides a small footprint and excellent thermal performance, making it ideal for space-constrained applications.

Width: 5 mm

With a width of just 5mm, this clock driver and buffer can fit in tight spaces without sacrificing performance.

Propagation Delay (tpd): 0.25 ns

The low propagation delay of 0.25 ns ensures fast and efficient signal transmission, making this product suitable for high-speed applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this clock driver and buffer can reliably function in a variety of environments without thermal issues.

Technical Specifications

Clock Drivers & Buffers NB7L1008MMNR4G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 3.3V

Family:

7L

Input Conditioning:

STANDARD

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

315 mA

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.025 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

NB7L1008MMNR4G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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