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NB3N1200KMNG

Onsemi

NB3N1200KMNG by Onsemi

NB3N1200KMNG clock driver by Onsemi features 64 terminals, 4.5ns propagation delay, and 3-STATE output characteristics. Ideal for applications requiring differential mux input conditioning, with a package style of CHIP CARRIER and operating temperature range of 0 to 70 °C.

Median Price

$6.930

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 22,880 parts In-Stock

1+ parts

$6.930

100+ parts

$5.180

1k+ parts

$4.500

10k+ parts

-

22,880

$6.930

$5.180

$4.500

-

DigiKey

USA . 240 parts In-Stock

1+ parts

$7.580

100+ parts

$4.959

1k+ parts

-

10k+ parts

-

240

$7.580

$4.959

-

-

Chip1Stop

Japan . 230 parts In-Stock

1+ parts

$27.800

100+ parts

$11.600

1k+ parts

-

10k+ parts

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230

$27.800

$11.600

-

-

Rochester

USA . 13,260 parts In-Stock

1+ parts

-

100+ parts

$4.070

1k+ parts

$3.640

10k+ parts

$3.420

13,260

-

$4.070

$3.640

$3.420

Verical

USA . 9,620 parts In-Stock

1+ parts

-

100+ parts

$5.325

1k+ parts

$4.763

10k+ parts

$4.475

9,620

-

$5.325

$4.763

$4.475

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 928 parts In-Stock

1+ parts

$4.503

100+ parts

-

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-

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928

$4.503

-

-

-

Bristol Electronics

USA . 87 parts In-Stock

1+ parts

$7.452

100+ parts

$3.502

1k+ parts

-

10k+ parts

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87

$7.452

$3.502

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-

Vyrian

USA . 8,607 parts In-Stock

1+ parts

-

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8,607

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K-1 Technologies

USA . 661 parts In-Stock

1+ parts

-

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661

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ACDS - Activité Composants Distribution Service

France . 87 parts In-Stock

1+ parts

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87

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Dan-Mar Components

USA . 87 parts In-Stock

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87

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,291 parts In-Stock

1+ parts

$4.266

100+ parts

-

1k+ parts

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10k+ parts

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2,291

$4.266

-

-

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Corohmni

South Africa . 343 parts In-Stock

1+ parts

$4.740

100+ parts

-

1k+ parts

-

10k+ parts

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343

$4.740

-

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Component Stockers USA

USA . 5,031 parts In-Stock

1+ parts

$4.850

100+ parts

$4.560

1k+ parts

$4.120

10k+ parts

-

5,031

$4.850

$4.560

$4.120

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Continental Prestige Electronics

USA . 3,640 parts In-Stock

1+ parts

$6.930

100+ parts

$5.180

1k+ parts

-

10k+ parts

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3,640

$6.930

$5.180

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Problanco Electronics

Mexico . 7,686 parts In-Stock

1+ parts

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7,686

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TANS Electronics

Latvia . 7,631 parts In-Stock

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7,631

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Kulean Microsystems

USA . 6,709 parts In-Stock

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6,709

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Perfect Parts

USA . 2,746 parts In-Stock

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2,746

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SupplyDigital Components

Austria . 1,857 parts In-Stock

1+ parts

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1,857

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UHIMA Technologies

Türkiye . 503 parts In-Stock

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503

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Authorized Procurement Solutions

USA . 230 parts In-Stock

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230

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GreenTree Electronics

Israel . 230 parts In-Stock

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230

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Overview

Elevate your clock driver performance with the NB3N1200KMNG by Onsemi. Designed with precision and reliability in mind, this innovative product offers differential mux input conditioning for seamless integration into a variety of applications. With a commercial-grade temperature grade and versatile surface mount capabilities, this clock driver ensures optimal operation with minimal delay. Experience the value of Onsemi's cutting-edge technology and unlock the potential for enhanced performance in your electronic systems. Choose the NB3N1200KMNG for superior quality and unmatched efficiency.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient placement on PCBs, saving space and making assembly simpler.

Input Conditioning: DIFFERENTIAL MUX

Enables efficient data transmission and signal routing, improving overall system performance.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard supply voltages, ensuring compatibility with a wide range of systems.

Propagation Delay (tpd): 4.5 ns

Provides fast signal processing, helping to synchronize different components in the system.

Maximum Operating Temperature: 70 °C

Allows for reliable operation even in higher temperature environments, offering robust performance.

No. of True Outputs: 24

Offers multiple outputs for driving various clock signals, increasing flexibility in system design.

Technical Specifications

Clock Drivers & Buffers NB3N1200KMNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

NB3

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

64

No. of True Outputs:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

4.5 ns

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

NB3N1200KMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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