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NB3N108KMNG

Onsemi

NB3N108KMNG by Onsemi

LOW SKEW CLOCK DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$7.375

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3 parts In-Stock

1+ parts

$10.710

100+ parts

$9.225

1k+ parts

$6.975

10k+ parts

$6.075

3

$10.710

$9.225

$6.975

$6.075

Flip Electronics (Authorized)

USA . 26,213 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,213

-

-

-

-

Rochester

USA . 6,792 parts In-Stock

1+ parts

-

100+ parts

$5.900

1k+ parts

$5.280

10k+ parts

$4.970

6,792

-

$5.900

$5.280

$4.970

Verical

USA . 6,725 parts In-Stock

1+ parts

-

100+ parts

$7.375

1k+ parts

$6.600

10k+ parts

$6.213

6,725

-

$7.375

$6.600

$6.213

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,227 parts In-Stock

1+ parts

$6.232

100+ parts

-

1k+ parts

-

10k+ parts

-

1,227

$6.232

-

-

-

Flip Electronics

USA . 26,065 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,065

-

-

-

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Vyrian

USA . 6,583 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,583

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10,557 parts In-Stock

1+ parts

$4.650

100+ parts

-

1k+ parts

-

10k+ parts

-

10,557

$4.650

-

-

-

Corohmni

South Africa . 487 parts In-Stock

1+ parts

$5.470

100+ parts

-

1k+ parts

-

10k+ parts

-

487

$5.470

-

-

-

Corphita

USA . 550 parts In-Stock

1+ parts

$5.904

100+ parts

-

1k+ parts

-

10k+ parts

-

550

$5.904

-

-

-

Component Stockers USA

USA . 26 parts In-Stock

1+ parts

$6.660

100+ parts

$6.260

1k+ parts

$5.660

10k+ parts

-

26

$6.660

$6.260

$5.660

-

Microchip USA

USA . 1,109 parts In-Stock

1+ parts

$29.988

100+ parts

-

1k+ parts

-

10k+ parts

-

1,109

$29.988

-

-

-

Problanco Electronics

Mexico . 2,660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,660

-

-

-

-

TANS Electronics

Latvia . 1,863 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,863

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-

-

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SupplyDigital Components

Austria . 1,247 parts In-Stock

1+ parts

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100+ parts

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1,247

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-

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Kulean Microsystems

USA . 1,088 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,088

-

-

-

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UHIMA Technologies

Türkiye . 503 parts In-Stock

1+ parts

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100+ parts

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503

-

-

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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100+ parts

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500

-

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Perfect Parts

USA . 143 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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143

-

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Continental Prestige Electronics

USA . 18 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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18

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-

-

-

Technical Specifications

Clock Drivers & Buffers NB3N108KMNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

3N

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

1.1 ns

Propagation Delay (tpd):

1.1 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

NB3N108KMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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