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NB100LVEP224FAG

Onsemi

NB100LVEP224FAG by Onsemi

NB100LVEP224FAG clock driver by Onsemi features a 0.75 ns propagation delay, 24 true outputs, and operates with supply voltages ranging from -2.5V to 3.8V. Ideal for applications requiring differential mux input conditioning in electronic systems with tight timing constraints.

Median Price

$23.110

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$19.950

1k+ parts

$17.850

10k+ parts

$16.800

100

-

$19.950

$17.850

$16.800

DigiKey

USA . 100 parts In-Stock

1+ parts

-

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$23.110

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$23.110

10k+ parts

$23.110

100

-

$23.110

$23.110

$23.110

Verical

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$24.938

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-

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100

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$24.938

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Distributors (In-Stock)

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Digiode

USA . 1,207 parts In-Stock

1+ parts

$21.109

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1,207

$21.109

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Vyrian

USA . 8,940 parts In-Stock

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8,940

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Zilex Electronics Inc.

Canada . 15 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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Corphita

USA . 1,145 parts In-Stock

1+ parts

$19.998

100+ parts

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1,145

$19.998

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Corohmni

South Africa . 54 parts In-Stock

1+ parts

$20.080

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54

$20.080

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Kulean Microsystems

USA . 5,999 parts In-Stock

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5,999

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TANS Electronics

Latvia . 5,980 parts In-Stock

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5,980

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A-Z Elektronik GmbH

Germany . 5,322 parts In-Stock

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5,322

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Problanco Electronics

Mexico . 4,210 parts In-Stock

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SupplyDigital Components

Austria . 2,822 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 1,239 parts In-Stock

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UHIMA Technologies

Türkiye . 762 parts In-Stock

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762

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Futuretech Components

Singapore . 708 parts In-Stock

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Microchip USA

USA . 494 parts In-Stock

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Kepictronics

USA . 235 parts In-Stock

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235

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Perfect Parts

USA . 179 parts In-Stock

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179

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Continental Prestige Electronics

USA . 100 parts In-Stock

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$18.920

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100

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$18.920

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Overview

Enhance your electronic designs with the NB100LVEP224FAG clock driver by Onsemi. Manufactured with top-quality materials and cutting-edge technology, this product offers unparalleled performance and reliability. Ideal for applications in clock distribution systems, data communication networks, and high-speed interfaces, this clock driver ensures smooth and efficient operation. With its low profile package design and fast propagation delay, the NB100LVEP224FAG provides exceptional value and benefits to our customers. Trust in Onsemi for superior products that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for portable devices.

Surface Mount: YES

Easy to integrate into circuit boards, saving space and reducing assembly time.

Input Conditioning: DIFFERENTIAL MUX

Allows for precise and accurate signal processing.

Nominal Supply Voltage / Vsup (V): 2.5

Standard voltage for compatibility with various systems.

Propagation Delay (tpd): 0.75 ns

Fast processing speed for efficient operation.

Maximum Operating Temperature: 85 °C

Suitable for a wide range of environmental conditions.

Technology: ECL

Enhanced performance and high-speed operation.

Technical Specifications

Clock Drivers & Buffers NB100LVEP224FAG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

64

No. of True Outputs:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay (tpd):

.75 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.04 ns

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

NB100LVEP224FAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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