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MMFT3055E

Onsemi

MMFT3055E by Onsemi

MMFT3055E by Onsemi is a N-CHANNEL FET with 60V DS breakdown voltage, ideal for SWITCHING applications. It features a single configuration with built-in diode, GULL WING terminals, and 0.15 ohm max drain-source resistance. Operating in enhancement mode, it has a max drain current of 1.7A and can handle up to 0.8W power dissipation at 150 °C.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 1,556 parts In-Stock

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Digiode

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Speed Components Ltd

Israel . 20 parts In-Stock

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Problanco Electronics

Mexico . 5,234 parts In-Stock

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Kulean Microsystems

USA . 4,501 parts In-Stock

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SupplyDigital Components

Austria . 4,232 parts In-Stock

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Corphita

USA . 2,446 parts In-Stock

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TANS Electronics

Latvia . 1,053 parts In-Stock

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UHIMA Technologies

Türkiye . 735 parts In-Stock

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Corohmni

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Overview

Experience the power of seamless performance with the MMFT3055E by Onsemi. Crafted with precision and expertise, this N-channel small signal field effect transistor offers unmatched reliability and efficiency in switching applications. Featuring a single configuration with a built-in diode, this transistor provides enhanced functionality while maintaining a low on-resistance. With a maximum operating temperature of 150 °C and a minimum breakdown voltage of 60V, this versatile component is ideal for a wide range of electronic projects. Trust Onsemi to deliver quality components that elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection, ensuring the transistor is not easily damaged during handling or operation.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and control in the specified direction, making it suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can protect against reverse current flow or voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in on/off operations.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this transistor can withstand higher voltages, making it suitable for various voltage levels.

Package Shape: RECTANGULAR

The rectangular shape accommodates efficient placement on circuit boards and facilitates standardized packaging.

Terminal Form: GULL WING

The gull wing terminals provide secure connections and are suitable for surface mount applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer high input impedance and low input current requirements, ideal for low power applications.

Maximum Drain Current (Abs) (ID): 1.7 A

Capable of handling higher currents, making it suitable for applications requiring moderate power output.

No. of Terminals: 4

Having 4 terminals provides flexibility in circuit connections and allows for versatile circuit configurations.

Maximum Power Dissipation (Abs): 0.8 W

With a high power dissipation capability, this transistor can handle heat effectively, ensuring reliable operation.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on PCBs and is suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes MOSFET technology for efficient switching and low power consumption, making it suitable for battery-operated devices.

Maximum Operating Temperature: 150 °C

Capable of operating at high temperatures, ensuring reliable performance in harsh environmental conditions.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability, making them a popular choice in various electronic applications.

Terminal Finish: TIN LEAD

The tin lead finish provides good solderability and ensures reliable electrical connections.

Maximum Drain-Source On Resistance: 0.15 ohm

Low on-resistance results in minimal power loss and efficient switching characteristics, ideal for high-efficiency applications.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit layout and allows for versatile connection options.

Case Connection: DRAIN

The drain connection ensures efficient current flow and heat dissipation, maintaining the transistor's performance and reliability.

Technical Specifications

Small Signal Field Effect Transistors (FET) MMFT3055E attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

1.7 A

Maximum Drain Current (ID):

1.7 A

Maximum Drain-Source On Resistance:

.15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MMFT3055E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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