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MMFT3055ET3

Onsemi

MMFT3055ET3 by Onsemi

MMFT3055ET3 by Onsemi is a N-CHANNEL FET with 60V DS breakdown voltage, ideal for SWITCHING applications. It features a max drain current of 1.7A and 0.15 ohm on-resistance, operating in ENHANCEMENT MODE at up to 150 °C. The package is a RECTANGULAR GULL WING style with PLASTIC/EPOXY body material, suitable for surface mount installations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,266 parts In-Stock

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Vyrian

USA . 914 parts In-Stock

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Problanco Electronics

Mexico . 8,140 parts In-Stock

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SupplyDigital Components

Austria . 5,504 parts In-Stock

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Kulean Microsystems

USA . 3,602 parts In-Stock

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TANS Electronics

Latvia . 2,582 parts In-Stock

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Corphita

USA . 1,084 parts In-Stock

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Corohmni

South Africa . 306 parts In-Stock

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UHIMA Technologies

Türkiye . 128 parts In-Stock

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Overview

Upgrade your electronics with the MMFT3055ET3 by Onsemi, a high-quality Small Signal Field Effect Transistor designed for switching applications. With a minimum DS breakdown voltage of 60V and a maximum drain current of 1.7A, this N-Channel transistor offers reliable performance in a compact package. The built-in diode and enhancement mode operation make it easy to integrate into your circuit design. Trust in Onsemi's expertise in semiconductor technology and elevate your projects with the MMFT3055ET3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the internal components of the FET, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility, making them suitable for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can provide protection against reverse voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance in on/off states.

Surface Mount: YES

Surface mount packaging allows for easy and compact integration into circuit boards.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET can handle higher voltages without damage.

Maximum Drain Current (Abs) (ID): 1.7 A

Capable of handling high drain currents up to 1.7A, making it suitable for various power applications.

Maximum Power Dissipation (Abs): 0.8 W

Efficient power dissipation of up to 0.8W ensures stable operation under load.

Maximum Operating Temperature: 150 °C

Can operate reliably at temperatures up to 150 °C, suitable for demanding environments.

Maximum Drain-Source On Resistance: 0.15 ohm

Low on-resistance allows for minimal voltage drop and power loss during operation.

Technical Specifications

Small Signal Field Effect Transistors (FET) MMFT3055ET3 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

1.7 A

Maximum Drain Current (ID):

1.7 A

Maximum Drain-Source On Resistance:

.15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MMFT3055ET3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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