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MMFT2955ET1G

Onsemi

MMFT2955ET1G by Onsemi

MMFT2955ET1G by Onsemi is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode, GULL WING terminals, and 0.3 ohm max drain-source resistance. Operating in enhancement mode, it has a max drain current of 1.2A and can handle up to 0.8W power dissipation at 150 °C.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,895 parts In-Stock

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Digiode

USA . 1,880 parts In-Stock

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AZTECH Wire

Italy . 616 parts In-Stock

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$14.510

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616

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Problanco Electronics

Mexico . 5,576 parts In-Stock

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SupplyDigital Components

Austria . 3,761 parts In-Stock

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Corphita

USA . 2,248 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Kulean Microsystems

USA . 1,141 parts In-Stock

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TANS Electronics

Latvia . 500 parts In-Stock

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Corohmni

South Africa . 290 parts In-Stock

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UHIMA Technologies

Türkiye . 39 parts In-Stock

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Overview

Enhance your electronic devices with the MMFT2955ET1G by Onsemi - a high-quality small signal Field Effect Transistor designed for efficient switching applications. Manufactured by Onsemi, a trusted name in semiconductor technology, this P-Channel FET offers reliable performance and a built-in diode for added convenience. Ideal for a variety of electronic projects, this transistor provides a maximum drain current of 1.2 A and a low drain-source on resistance of 0.3 ohms. Upgrade your circuits with Onsemi's MMFT2955ET1G for enhanced functionality and optimal power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various operating conditions.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low RDS(on) values and high current-handling capabilities, ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in preventing voltage spikes and reverse currents, enhancing the reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and controlled switching of signals.

Surface Mount: YES

SMT technology allows for easy and reliable PCB assembly, saving space and improving overall circuit performance.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this transistor can handle higher voltages without breakdown, improving reliability.

Maximum Drain Current (Abs) (ID): 1.2 A

Can handle high drain currents, making it suitable for applications that require power switching.

Maximum Power Dissipation (Abs): 0.8 W

The low power dissipation helps in maintaining the transistor's temperature within safe limits, preventing overheating.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, suitable for industrial applications.

Maximum Drain-Source On Resistance: 0.3 ohm

Low RDS(on) enhances the efficiency of the transistor by reducing power losses and improving switching speed.

Technical Specifications

Small Signal Field Effect Transistors (FET) MMFT2955ET1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

1.2 A

Maximum Drain Current (ID):

1.2 A

Maximum Drain-Source On Resistance:

.3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MMFT2955ET1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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