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MMFT3055VT1

Onsemi

MMFT3055VT1 by Onsemi

MMFT3055VT1 by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 1.7A, 0.13 ohm Drain-Source Resistance, and operates in ENHANCEMENT MODE. This small outline transistor has a power dissipation of 2.1W and can withstand temperatures up to 175 °C.

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Vyrian

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Digiode

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Bristol Electronics

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Flex Direct, LLC

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Semi Source

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ComSIT Distribution GmbH

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Prism Electronics

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Kepictronics

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TANS Electronics

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Kulean Microsystems

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Overview

Experience superior performance and reliability with the MMFT3055VT1 by Onsemi. As a leader in Small Signal Field Effect Transistors, Onsemi delivers top-notch quality and precision engineering in every product. This N-CHANNEL transistor with a built-in diode is perfect for switching applications. With a maximum drain current of 1.7 A and a minimum DS breakdown voltage of 60 V, this transistor offers unmatched efficiency and power. Trust Onsemi to provide cutting-edge technology and innovation for all your electronic needs. Invest in the MMFT3055VT1 today and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the transistor suitable for various applications.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow in the specified direction, enhancing performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and helps protect the transistor from reverse currents, improving overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance and efficiency in such use cases.

Surface Mount: YES

Enables easy and secure mounting on circuit boards, saving space and streamlining the manufacturing process.

Maximum Drain Current (Abs) (ID): 1.7 A

Can handle high current levels, suitable for a wide range of applications requiring power switching capabilities.

Maximum Power Dissipation (Abs): 2.1 W

Efficiently dissipates heat generated during operation, ensuring reliable performance under varying load conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high switching speeds, low power consumption, and reliable operation, making it an ideal choice for switching applications.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without compromising performance, suitable for use in demanding environments.

Moisture Sensitivity Level (MSL): 3

With MSL 3, the transistor is less sensitive to moisture exposure during storage or assembly, offering better reliability in humid conditions.

Technical Specifications

Small Signal Field Effect Transistors (FET) MMFT3055VT1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

1.7 A

Maximum Drain Current (ID):

1.7 A

Maximum Drain-Source On Resistance:

.13 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

50 pF

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MMFT3055VT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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