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MMFT3055VLT1G

Onsemi

MMFT3055VLT1G by Onsemi

MMFT3055VLT1G by Onsemi is a N-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It has a max drain current of 1.5A and 0.14 ohm on-resistance. The transistor operates in enhancement mode, with a max power dissipation of 2W at 175 °C.

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3

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1k+

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Vyrian

USA . 1,736 parts In-Stock

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Speed Components Ltd

Israel . 335 parts In-Stock

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Digiode

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Metaverse IC Inc.

Canada . 86,168 parts In-Stock

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Kepictronics

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SupplyDigital Components

Austria . 7,690 parts In-Stock

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Kulean Microsystems

USA . 7,155 parts In-Stock

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TANS Electronics

Latvia . 5,533 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Problanco Electronics

Mexico . 1,062 parts In-Stock

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UHIMA Technologies

Türkiye . 791 parts In-Stock

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Corohmni

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Overview

Experience superior performance and reliability with the Onsemi MMFT3055VLT1G Small Signal Field Effect Transistor. Crafted with precision by the renowned manufacturer, Onsemi, this N-CHANNEL transistor boasts a single configuration with a built-in diode, perfect for switching applications. With a minimum DS breakdown voltage of 60V and maximum drain current of 1.5A, this transistor offers unmatched efficiency and power handling capabilities. Ideal for a wide range of electronic devices, this transistor is designed to enhance your projects while providing exceptional value and benefits to customers. Elevate your designs with the MMFT3055VLT1G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, enhancing the reliability and longevity of the transistor.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower ON resistance and higher current carrying capabilities compared to P-CHANNEL FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against reverse current flow, improving overall performance and reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and reliable transitions between ON and OFF states.

Maximum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle larger voltages without the risk of damage, making it suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and convenient integration onto circuit boards, saving space and simplifying the assembly process.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control and efficiency compared to depletion mode transistors, making them ideal for various switching applications.

Maximum Drain Current (Abs) (ID): 1.5 A

Capable of handling high current loads, making it suitable for applications that require significant power output.

Maximum Power Dissipation (Abs): 2 W

Can dissipate heat efficiently, allowing for continuous operation under high power conditions without overheating.

Maximum Drain-Source On Resistance: 0.14 ohm

Low ON resistance minimizes power loss and heat generation, improving efficiency and performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) MMFT3055VLT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

1.5 A

Maximum Drain Current (ID):

1.5 A

Maximum Drain-Source On Resistance:

.14 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

60 pF

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MMFT3055VLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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