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MMFT2N25ET3

Onsemi

MMFT2N25ET3 by Onsemi

MMFT2N25ET3 by Onsemi is a N-CHANNEL FET with 250V DS Breakdown Voltage and 2A ID. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE, this FET has 3.5 ohm RDS(on) and 10pF Crss capacitance.

Median Price

$0.192

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$0.185

1k+ parts

$0.153

10k+ parts

$0.137

4,000

-

$0.185

$0.153

$0.137

DigiKey

USA . 4,000 parts In-Stock

1+ parts

-

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$0.230

4,000

-

-

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$0.230

Verical

USA . 4,000 parts In-Stock

1+ parts

-

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$0.192

4,000

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$0.192

Distributors (In-Stock)

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Vyrian

USA . 825 parts In-Stock

1+ parts

$0.127

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-

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825

$0.127

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Digiode

USA . 1,943 parts In-Stock

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$0.144

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1,943

$0.144

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Distributors (Availability)

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Corohmni

South Africa . 397 parts In-Stock

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$0.127

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397

$0.127

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Corphita

USA . 1,085 parts In-Stock

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$0.137

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1,085

$0.137

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Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$1.526

100+ parts

$1.511

1k+ parts

$1.450

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-

10

$1.526

$1.511

$1.450

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Kepictronics

USA . 44,000 parts In-Stock

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44,000

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Assy Fe

Spain . 44,000 parts In-Stock

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RC Electronics

USA . 39,600 parts In-Stock

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TANS Electronics

Latvia . 7,788 parts In-Stock

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Problanco Electronics

Mexico . 5,407 parts In-Stock

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SupplyDigital Components

Austria . 4,826 parts In-Stock

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Continental Prestige Electronics

USA . 4,000 parts In-Stock

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$0.139

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$0.139

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Kulean Microsystems

USA . 1,838 parts In-Stock

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UHIMA Technologies

Türkiye . 523 parts In-Stock

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523

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Overview

Elevate your electronics with the MMFT2N25ET3 by Onsemi, a top-tier manufacturer known for superior quality and reliability. As part of the Small Signal Field Effect Transistors category, this N-CHANNEL FET offers exceptional performance in switching applications. With a minimum DS Breakdown Voltage of 250V and a Maximum Drain Current of 2A, this transistor is designed to enhance your circuits with efficiency and precision. Say goodbye to technical woes and hello to seamless operation with the MMFT2N25ET3 – your go-to solution for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to environmental factors, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency compared to P-channel FETs, making them a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode provides reverse voltage protection and simplifies circuit design, making the product more versatile and user-friendly.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring high efficiency and fast operation.

Surface Mount: YES

Surface mount capability makes the product easy to integrate into compact circuit designs and PCBs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer lower on-resistance and higher efficiency compared to depletion mode FETs, making them suitable for various applications.

Maximum DS Breakdown Voltage: 250 V

High breakdown voltage ensures reliable operation in applications where high voltage levels may be encountered.

Maximum Drain Current (ID): 2 A

High drain current rating allows the FET to handle larger current loads, making it suitable for applications with higher power requirements.

Maximum Drain-Source On Resistance: 3.5 ohm

Low on-resistance leads to reduced power losses and improved efficiency in switching applications.

Maximum Feedback Capacitance (Crss): 10 pF

Low feedback capacitance minimizes the risk of unwanted oscillations and improves high-frequency performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) MMFT2N25ET3 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

3.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

10 pF

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MMFT2N25ET3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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