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MMFT2N02ELT1

Onsemi

MMFT2N02ELT1 by Onsemi

MMFT2N02ELT1 by Onsemi is a N-CHANNEL FET with 20V DS breakdown voltage and 1.6A max drain current, ideal for switching applications. It features a built-in diode, operates in enhancement mode, and has a 0.15 ohm max on-resistance. The small outline package with gull wing terminals makes it suitable for surface mount designs at up to 150 °C operating temperature.

Median Price

$0.304

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 880 parts In-Stock

1+ parts

-

100+ parts

$0.304

1k+ parts

$0.252

10k+ parts

$0.225

880

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$0.304

$0.252

$0.225

Distributors (In-Stock)

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Digiode

USA . 422 parts In-Stock

1+ parts

$0.237

100+ parts

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422

$0.237

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Component Electronics Inc.

Canada . 931 parts In-Stock

1+ parts

$0.380

100+ parts

$0.290

1k+ parts

$0.250

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931

$0.380

$0.290

$0.250

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Vyrian

USA . 8,536 parts In-Stock

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8,536

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Mil-Aero Solutions, Inc.

USA . 4,214 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,697 parts In-Stock

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1,697

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Bristol Electronics

USA . 1,436 parts In-Stock

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1,436

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Inventory MP

USA . 1,105 parts In-Stock

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Global Solutions Electronics Company

USA . 1,000 parts In-Stock

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Atlantic Semiconductor

USA . 331 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 195 parts In-Stock

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$0.224

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195

$0.224

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Corohmni

South Africa . 394 parts In-Stock

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$0.249

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394

$0.249

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Component Stockers USA

USA . 1,046 parts In-Stock

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$0.250

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$0.240

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1,046

$0.250

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,985 parts In-Stock

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TANS Electronics

Latvia . 6,651 parts In-Stock

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SupplyDigital Components

Austria . 4,841 parts In-Stock

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Problanco Electronics

Mexico . 3,989 parts In-Stock

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Kulean Microsystems

USA . 794 parts In-Stock

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Glotronic Ltd.

UK . 388 parts In-Stock

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388

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UHIMA Technologies

Türkiye . 98 parts In-Stock

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Overview

Unleash the power of innovation with the MMFT2N02ELT1 by Onsemi. Crafted with precision and reliability in mind, this N-CHANNEL Small Signal Field Effect Transistor (FET) with a built-in diode is ideal for switching applications. Its sleek rectangular design and gull wing terminals make it perfect for surface mount installations. With a maximum drain current of 1.6 A and a minimum DS breakdown voltage of 20 V, this transistor offers top-notch performance and efficiency. Upgrade your projects with the MMFT2N02ELT1 and experience superior quality and unparalleled value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications in different environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance characteristics compared to P-channel transistors, making them a preferred choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more versatile usage and can provide additional functionality in certain circuit designs.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and low power dissipation, making it efficient for such tasks.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving space and reducing overall production costs.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle higher voltage levels, ensuring reliable operation in various circuits.

Maximum Drain Current (Abs) (ID): 1.6 A

The high maximum drain current capability of 1.6A enables the transistor to handle higher current loads, making it suitable for a wide range of applications.

Maximum Power Dissipation (Abs): 0.8 W

The low maximum power dissipation of 0.8W indicates that the transistor operates efficiently and can handle power without overheating.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand higher temperatures, making it suitable for applications where heat dissipation is a concern.

Technical Specifications

Small Signal Field Effect Transistors (FET) MMFT2N02ELT1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

1.6 A

Maximum Drain Current (ID):

1.6 A

Maximum Drain-Source On Resistance:

.15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MMFT2N02ELT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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