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MMBD101

Onsemi

MMBD101 by Onsemi

The Onsemi MMBD101 is a single Schottky mixer diode with ultra high frequency band. It features a max diode capacitance of 1 pF and comes in a small outline rectangular package for surface mount applications. Ideal for microwave mixing and detecting in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Electronic Expediters

USA . 24,205 parts In-Stock

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Digiode

USA . 1,190 parts In-Stock

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Vyrian

USA . 526 parts In-Stock

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ES Components

USA . 350 parts In-Stock

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TANS Electronics

Latvia . 5,691 parts In-Stock

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SupplyDigital Components

Austria . 3,494 parts In-Stock

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Kulean Microsystems

USA . 2,768 parts In-Stock

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Corphita

USA . 2,045 parts In-Stock

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UHIMA Technologies

Türkiye . 968 parts In-Stock

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Corohmni

South Africa . 425 parts In-Stock

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Problanco Electronics

Mexico . 348 parts In-Stock

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Overview

Discover the MMBD101 by Onsemi, a top-tier Microwave Mixer & Detector Diode that stands out for its exceptional quality and performance. Manufactured by Onsemi, a reputable industry leader, this product offers superior reliability and precision. With applications in ultra high frequency bands, this diode is perfect for a wide range of electronic devices. Experience the value and benefits of the MMBD101, from its compact design to its cutting-edge Schottky technology. Elevate your projects with this innovative solution that delivers unmatched performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components, ensuring a longer lifespan for the product.

Config: SINGLE

Simplifies the design and operation of the product, making it easier to use.

Frequency Band: ULTRA HIGH FREQUENCY

Ideal for applications requiring high frequency signals, providing accurate and precise results.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during assembly.

Maximum Diode Capacitance: 1 pF

Low capacitance ensures minimal signal loss, resulting in efficient performance of the product.

Package Shape: RECTANGULAR

Compact shape saves space and allows for easy integration into various systems.

No. of Terminals: 3

Provides multiple connection points for flexibility in wiring and connectivity.

Package Style (Meter): SMALL OUTLINE

Space-saving design makes it suitable for compact devices and applications.

Terminal Position: DUAL

Offers redundancy and reliability in signal transmission, reducing the risk of signal loss.

Diode Type: MIXER DIODE

Specifically designed for mixing RF signals, ensuring optimal performance in signal processing applications.

Technology: SCHOTTKY

Schottky diodes have low forward voltage drop and fast switching, making them ideal for high frequency applications.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and provide secure connections, enhancing the overall reliability of the product.

Diode Element Material: SILICON

Silicon diodes offer high reliability and stability, ensuring consistent performance over time.

Technical Specifications

Microwave Mixer & Detector Diodes MMBD101 attributes and parameters. Explore more Microwave Mixer & Detector Diodes devices from Onsemi

Specs

Config:

SINGLE

Maximum Diode Capacitance:

1 pF

Diode Element Material:

SILICON

Diode Type:

Frequency Band:

ULTRA HIGH FREQUENCY

JEDEC-95 Code:

TO-236AA

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Form:

Terminal Position:

Trade Compliance

MMBD101 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.60

SB

8541.10.00.60

NSN

5961-01-375-0809, 5961013750809

NIIN

013750809

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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