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MMBD301LT3G

Onsemi

MMBD301LT3G by Onsemi

MMBD301LT3G by Onsemi is a single Schottky mixer diode with ultra high frequency band. It has a max forward voltage of 0.45V and can operate in temperatures ranging from -55 to 125°C. Ideal for microwave applications, this diode comes in a small outline package with matte tin finish for surface mount assembly.

Median Price

$0.032

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 18,064 parts In-Stock

1+ parts

$0.036

100+ parts

$0.030

1k+ parts

$0.025

10k+ parts

$0.021

18,064

$0.036

$0.030

$0.025

$0.021

Mouser Electronics

USA . 17,201 parts In-Stock

1+ parts

$0.100

100+ parts

$0.038

1k+ parts

$0.034

10k+ parts

$0.032

17,201

$0.100

$0.038

$0.034

$0.032

Verical

USA . 130,000 parts In-Stock

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-

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$0.022

130,000

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$0.022

DigiKey

USA . 34,936 parts In-Stock

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$0.028

34,936

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-

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$0.028

Chip1Stop

Japan . 19,367 parts In-Stock

1+ parts

-

100+ parts

$0.043

1k+ parts

$0.034

10k+ parts

$0.028

19,367

-

$0.043

$0.034

$0.028

Rochester

USA . 2,159 parts In-Stock

1+ parts

-

100+ parts

$0.029

1k+ parts

$0.024

10k+ parts

$0.022

2,159

-

$0.029

$0.024

$0.022

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,595 parts In-Stock

1+ parts

$0.024

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-

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1,595

$0.024

-

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Nova Conductors

Japan . 450 parts In-Stock

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$0.054

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450

$0.054

-

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Bristol Electronics

USA . 7,555 parts In-Stock

1+ parts

$0.124

100+ parts

$0.062

1k+ parts

$0.025

10k+ parts

$0.015

7,555

$0.124

$0.062

$0.025

$0.015

Flip Electronics

USA . 70,000 parts In-Stock

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Chip Stock

USA . 43,000 parts In-Stock

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Vyrian

USA . 22,707 parts In-Stock

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NAC Semi

USA . 20,000 parts In-Stock

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$0.049

20,000

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$0.049

Cyclops Electronics Ltd

UK . 9,905 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 7,555 parts In-Stock

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Dan-Mar Components

USA . 7,555 parts In-Stock

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M&R Communications

USA . 5,662 parts In-Stock

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5,662

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Distributors (Availability)

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Ampacity Inc.

Singapore . 22,718 parts In-Stock

1+ parts

$0.021

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22,718

$0.021

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Semicontronic

India . 22,391 parts In-Stock

1+ parts

$0.021

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$0.020

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$0.020

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22,391

$0.021

$0.020

$0.020

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Corphita

USA . 1,734 parts In-Stock

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$0.022

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1,734

$0.022

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Corohmni

South Africa . 178 parts In-Stock

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$0.025

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178

$0.025

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Argo Parts USA

USA . 2,373 parts In-Stock

1+ parts

$0.054

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$0.052

2,373

$0.054

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$0.052

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.054

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$0.054

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Continental Prestige Electronics

USA . 1,411 parts In-Stock

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$0.054

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$0.053

1,411

$0.054

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$0.053

Aztec Data Supply Inc.

USA . 2,433 parts In-Stock

1+ parts

$0.086

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2,433

$0.086

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iodParts Technologies Inc.

India . 9,870 parts In-Stock

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Problanco Electronics

Mexico . 7,190 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Kulean Microsystems

USA . 6,077 parts In-Stock

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TANS Electronics

Latvia . 4,851 parts In-Stock

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SupplyDigital Components

Austria . 2,255 parts In-Stock

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UHIMA Technologies

Türkiye . 957 parts In-Stock

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957

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Robosynatics

Brazil . 500 parts In-Stock

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$0.177

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$0.177

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$0.177

500

-

$0.177

$0.177

$0.177

Lucentia Tech

USA . 500 parts In-Stock

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$0.177

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$0.177

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$0.177

500

-

$0.177

$0.177

$0.177

Speed Components Ltd (Excess)

Israel . 75 parts In-Stock

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Overview

Experience the cutting-edge technology of the MMBD301LT3G by Onsemi, a top-tier manufacturer known for excellence in the field of Microwave Mixer & Detector Diodes. This high-quality product offers customers the advantage of ultra-high frequency performance with a small outline package design. Perfect for a variety of applications, this diode ensures reliable and efficient operation while providing a maximum operating temperature of 125°C. Trust in the expertise of Onsemi to deliver value, benefits, and advantages that exceed expectations. Elevate your projects with the MMBD301LT3G and unlock new possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in a variety of operating conditions.

Config: SINGLE

The single configuration simplifies the design and installation process, making it user-friendly.

Frequency Band: ULTRA HIGH FREQUENCY

Operating in the ultra high frequency band allows for high-speed and efficient performance in demanding applications.

Surface Mount: YES

The surface mount capability enables easy and secure installation on circuit boards, saving space and reducing assembly time.

Maximum Diode Capacitance: 1.5 pF

With a low diode capacitance, this product offers excellent signal integrity and high-frequency performance.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and space-saving design suitable for various applications.

No. of Terminals: 3

Having three terminals allows for versatile connectivity options and flexibility in circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers a lightweight and compact design, ideal for portable electronics.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environments and extended usage.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures reliable performance in cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and resistance to corrosion, enhancing product longevity.

Terminal Position: DUAL

The dual terminal position allows for secure and stable connections, minimizing signal loss and interference.

Maximum Power Dissipation: 0.2 W

With a maximum power dissipation of 0.2W, this product can handle high-power applications efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time of 30 seconds ensures quick and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures strong and durable solder joints for long-lasting performance.

Diode Type: MIXER DIODE

This mixer diode type is suitable for mixing and detecting microwave signals, making it ideal for RF applications.

Maximum Forward Voltage (VF): 0.45 V

The low maximum forward voltage reduces power consumption and improves overall efficiency.

Technology: SCHOTTKY

The Schottky technology offers high-speed switching and low voltage drop, enhancing product performance.

Terminal Form: GULL WING

The gull wing terminal form provides reliable mechanical strength and solder joint integrity for secure connections.

Maximum Repetitive Peak Reverse Voltage: 30 V

With a maximum repetitive peak reverse voltage of 30V, this product offers robust protection against reverse current flow.

Diode Element Material: SILICON

The use of silicon diode element material ensures stable and consistent performance over a wide range of operating conditions.

Technical Specifications

Microwave Mixer & Detector Diodes MMBD301LT3G attributes and parameters. Explore more Microwave Mixer & Detector Diodes devices from Onsemi

Specs

Config:

SINGLE

Maximum Diode Capacitance:

1.5 pF

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.45 V

Frequency Band:

ULTRA HIGH FREQUENCY

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Power Dissipation:

.2 W

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

30 V

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

MMBD301LT3G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.60

SB

8541.10.00.60

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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