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MJW21193

Onsemi

MJW21193 by Onsemi

MJW21193 by Onsemi is a PNP BJT transistor with 200W power dissipation, 250V max collector-emitter voltage, and 16A max collector current. Ideal for amplifier applications due to its single configuration and silicon element material. Package style is flange mount with through-hole terminals.

Median Price

$4.898

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Freelance Electronics

USA . 47 parts In-Stock

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$4.898

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$5.143

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$4.849

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Vyrian

USA . 8,907 parts In-Stock

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Digiode

USA . 921 parts In-Stock

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Lakeland Logistics Inc

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Bristol Electronics

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Connector Distribution Corp

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Right Parts Inc.

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Corohmni

South Africa . 370 parts In-Stock

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$4.898

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370

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AZTECH Wire

Italy . 775 parts In-Stock

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$11.790

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775

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Kulean Microsystems

USA . 6,649 parts In-Stock

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SupplyDigital Components

Austria . 5,909 parts In-Stock

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TANS Electronics

Latvia . 5,742 parts In-Stock

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Problanco Electronics

Mexico . 4,670 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 145 parts In-Stock

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Overview

Looking for a reliable power transistor to boost your amplifier performance? Look no further than the Onsemi MJW21193. With a maximum power dissipation of 200W and a maximum collector-emitter voltage of 250V, this PNP transistor is perfect for high-power applications. Its single configuration and isolated case connection make installation a breeze, while its silicon element material ensures long-lasting durability. Trust Onsemi's reputation for quality and innovation to deliver the best in power bipolar junction transistors. Upgrade your amplifier today with the MJW21193 and experience a whole new level of performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body enhances the durability and reliability of the transistor in various operating conditions.

Polarity or Channel Type: PNP

The PNP polarity makes this transistor suitable for applications where PNP transistors are required, offering versatility in circuit design.

Configuration: SINGLE

The single configuration simplifies the circuit design and makes it easier to integrate this transistor into a system.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor ensures efficient signal amplification with minimal distortion.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and placement on circuit boards, optimizing space utilization.

Maximum Power Dissipation (Abs): 200 W

With a high power dissipation capacity of 200W, this transistor can handle high power levels without thermal issues.

Maximum Collector-Emitter Voltage: 250 V

The high collector-emitter voltage rating of 250V ensures the transistor can withstand high voltage levels in the circuit.

Nominal Transition Frequency (fT): 4 MHz

The high nominal transition frequency of 4 MHz allows for high-speed switching and amplification, making it suitable for fast signal processing applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJW21193 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

250 V

Configuration:

Minimum DC Current Gain (hFE):

8

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MJW21193 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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