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MJD210-I

Onsemi

MJD210-I by Onsemi

The Onsemi MJD210-I is a PNP BJT with VCEsat of 1.8V, hFE of 10, and IC of 5A. Ideal for power applications in electronics due to its high power dissipation (12.5W) and low collector-emitter voltage (25V). Its silicon element material ensures reliable performance at up to 150 °C ambient temperature.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,470 parts In-Stock

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Digiode

USA . 1,272 parts In-Stock

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Problanco Electronics

Mexico . 8,316 parts In-Stock

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Kulean Microsystems

USA . 8,082 parts In-Stock

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SupplyDigital Components

Austria . 7,784 parts In-Stock

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TANS Electronics

Latvia . 2,010 parts In-Stock

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Corphita

USA . 1,548 parts In-Stock

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Supply Digital

USA . 594 parts In-Stock

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UHIMA Technologies

Türkiye . 473 parts In-Stock

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Corohmni

South Africa . 248 parts In-Stock

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Overview

Experience the superior quality and performance of the MJD210-I Power Bipolar Junction Transistor by Onsemi. With a reputation for excellence in manufacturing, Onsemi delivers a reliable product that is perfect for a variety of applications. From power supplies to motor controls, this PNP transistor offers exceptional value and benefits to customers. Trust in the expertise of Onsemi and elevate your projects with the MJD210-I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: PNP

Allows for easier integration with other PNP transistors in circuits.

Configuration: SINGLE

Simplifies circuit design and installation, ideal for single transistor applications.

Maximum VCEsat: 1.8 V

Low saturation voltage helps minimize power loss and improve efficiency.

Package Shape: RECTANGULAR

Facilitates easy placement and mounting in circuit boards.

Terminal Form: THROUGH-HOLE

Enables secure soldering and strong connections, suitable for through-hole PCB mounting.

Maximum Power Dissipation (Abs): 12.5 W

Can handle high power loads without risking damage to the transistor.

Package Style (Meter): IN-LINE

Helps in easy identification and organization of components in circuit layouts.

Maximum Power Dissipation Ambient: 1.4 W

Sufficient heat dissipation capability to ensure reliable operation in various environmental conditions.

Minimum DC Current Gain (hFE): 10

Provides consistent and predictable amplification of current in the circuit.

Maximum Operating Temperature: 150 °C

Can withstand high-temperature environments, increasing the range of applications for this transistor.

Maximum Collector-Base Capacitance: 120 pF

Low capacitance ensures stability in high-frequency applications.

Maximum Collector-Emitter Voltage: 25 V

Can handle high voltage levels without breakdown, ensuring reliability in operation.

Transistor Element Material: SILICON

Silicon material offers good performance characteristics such as high voltage tolerance and low leakage current.

Maximum Collector Current (IC): 5 A

Can handle high currents without overheating, suitable for power applications.

Terminal Position: SINGLE

Simplifies connection and wiring, reducing chances of errors in circuit assembly.

Nominal Transition Frequency (fT): 65 MHz

Suitable for high-frequency applications such as RF amplification or signal processing.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJD210-I attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

5 A

Maximum Collector-Base Capacitance:

120 pF

Maximum Collector-Emitter Voltage:

25 V

Configuration:

Minimum DC Current Gain (hFE):

10

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

PNP

Maximum Power Dissipation Ambient:

1.4 W

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum VCEsat:

1.8 V

Trade Compliance

MJD210-I Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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