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MCH3445

Onsemi

MCH3445 by Onsemi

MCH3445 by Onsemi is a N-CHANNEL Power FET with 2A max drain current and 0.8W power dissipation. It operates in enhancement mode, suitable for surface mount applications up to 150 °C. Ideal for high-power electronic devices requiring efficient switching capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,348 parts In-Stock

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2,348

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Vyrian

USA . 805 parts In-Stock

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805

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SupplyDigital Components

Austria . 7,640 parts In-Stock

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7,640

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TANS Electronics

Latvia . 5,344 parts In-Stock

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Kepictronics

USA . 4,000 parts In-Stock

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4,000

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Problanco Electronics

Mexico . 3,208 parts In-Stock

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Kulean Microsystems

USA . 1,719 parts In-Stock

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Corphita

USA . 1,712 parts In-Stock

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1,712

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Corohmni

South Africa . 351 parts In-Stock

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UHIMA Technologies

Türkiye . 111 parts In-Stock

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Overview

Discover the unbeatable quality and reliability of the MCH3445 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch performance and durability in their Power Field Effect Transistors. Ideal for a wide range of applications, this N-CHANNEL FET offers enhanced efficiency and power management. With a maximum drain current of 2A and a maximum power dissipation of 0.8W, customers can trust in the value and benefits that the MCH3445 brings to their projects. Upgrade your electronic designs with the unmatched advantages of Onsemi's MCH3445 today.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs generally have lower ON-resistance compared to P-CHANNEL FETs, allowing for efficient power handling.

Configuration: SINGLE

SINGLE configuration simplifies circuit design and ensures ease of use for various applications.

Surface Mount: YES

Surface mount capability allows for easy and compact integration into circuit boards, saving space and facilitating mass production.

Operating Mode: ENHANCEMENT MODE

ENHANCEMENT MODE FETs offer fast switching speeds and high efficiency, making them ideal for power management applications.

Maximum Drain Current (Abs) (ID): 2 A

With a high maximum drain current, this FET can handle heavy loads with ease, making it suitable for power applications.

Maximum Power Dissipation (Abs): 0.8 W

The low maximum power dissipation ensures efficient operation and helps in preventing overheating, extending the FET's lifespan.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

METAL-OXIDE SEMICONDUCTOR technology offers high reliability, low leakage current, and excellent thermal stability for consistent performance.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand harsh environmental conditions and operate reliably in demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) MCH3445 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

MCH3445 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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